main
Download ZIP Propose a change
Generated by kicad-footprint-generator · KiCad file format 20260206
Name Last commit message Last updated
docs Publish 0.1.0 · Ray 13d ago
viewers bc858c-7-f: viewers · Ray 13d ago
bc858c-7-f-etched.glb Publish 0.1.0 · Ray 13d ago
bc858c-7-f-etched.step bc858c-7-f: factory component page (tier=lcsc) · Ray 13d ago
bc858c-7-f-hero.glb bc858c-7-f: hero GLB from the etched model (keeps the MPN mark) · Ray 13d ago
bc858c-7-f-hero.overlay.json Publish 0.1.0 · Ray 13d ago
bc858c-7-f.glb Publish 0.1.0 · Ray 13d ago
bc858c-7-f.kicad_mod Publish 0.1.0 · Ray 13d ago
bc858c-7-f.kicad_sym Publish 0.1.0 · Ray 13d ago
bc858c-7-f.lbr Publish 0.1.0 · Ray 13d ago
bc858c-7-f.step Publish 0.1.0 · Ray 13d ago
package.json Publish 0.1.0 · Ray 13d ago
page.json Set visibility: public · Ray 13d ago
README.md Publish 0.1.0 · Ray 13d ago

BC858C-7-F

Diodes Incorporated · Bipolar (BJT) · SOT-23

BC858C-7-F from Diodes Incorporated, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 B input Base; drive terminal of the PNP transistor, with VEBO rated at -5.0 V maximum.
2 E passive Emitter; PNP emitter terminal, with peak emitter current IEM of -200 mA.
3 C passive Collector; continuous collector current IC is -100 mA maximum, and VCEO is -30 V for BC858C.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOT-23
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Collector-Base Breakdown Voltage (BC858A/B/C) BVCBO -30 V IC = -10µA 4
Collector-Emitter Breakdown Voltage (BC858A/B/C) BVCEO -30 V IC = -10mA 4
Emitter-Base Breakdown Voltage BVEBO -5 V IE = -1µA 4
Collector Cutoff Current ICBO -15 nA VCB = -30V 4
Collector Cutoff Current ICBO -4 µA VCB = -30V, TJ = +150°C 4
Collector Emitter Cutoff Current (BC858A/B/C) ICES -15 nA VCE = -30V 4
Emitter-Base Cutoff Current IEBO -100 nA VEB = -5V 4
Small Signal Current Gain (BC857C/BC858C) hfe 600 IC = -2.0mA, VCE = -5V, f = 1.0kHz 4
DC Current Gain (BC857C/BC858C) hFE 420 520 800 IC = -2.0mA, VCE = -5V 4
Collector-Emitter Saturation Voltage VCE(sat) -75 -300 mV IC = -10mA, IB = -0.5mA 4
Collector-Emitter Saturation Voltage VCE(sat) -250 -650 mV IC = -100mA, IB = -5.0mA 4
Base-Emitter Turn-On Voltage VBE(on) -600 -650 -750 mV IC = -2mA, VCE = -5V 4
Base-Emitter Turn-On Voltage VBE(on) -820 mV IC = -10mA, VCE = -5V 4
Base-Emitter Saturation Voltage VBE(sat) -700 mV IC = -10mA, IB = -0.5mA 4
Base-Emitter Saturation Voltage VBE(sat) -850 -1100 mV IC = -100mA, IB = -5mA 4
Transition Frequency fT 100 200 MHz VCE = -5V, IC = -10mA, f = 100MHz 4
Noise Figure NF 2 10 dB VCE = -5V, IC = -200µA, RS = 2kΩ, f = 1kHz, Δf = 200Hz 4
Collector-Base Voltage (BC858A/B/C) VCBO -30 V 2
Collector-Emitter Voltage (BC858A/B/C) VCEO -30 V 2
Emitter-Base Voltage VEBO -5 V 2
Continuous Collector Current IC -100 mA 2
Peak Collector Current (Single Pulse) ICM -200 mA 2
Peak Emitter Current IEM -200 mA 2
Peak Base Current (Single Pulse) IBM -200 mA 2
Power Dissipation PD 310 mW Note 5: minimum recommended pad layout, 1oz copper, still air 2
Power Dissipation PD 350 mW Note 6: 15mm x 15mm 1oz copper 2
Thermal Resistance, Junction to Ambient RθJA 403 °C/W Note 5: minimum recommended pad layout, 1oz copper, still air 2
Thermal Resistance, Junction to Ambient RθJA 357 °C/W Note 6: 15mm x 15mm 1oz copper 2
Thermal Resistance, Junction to Leads RθJL 350 °C/W Note 7: junction to solder-point 2
Operating and Storage Temperature Range TJ, TSTG -55 150 °C 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin • Terminals: Finish, Matte Tin Plated Leads, Solderable per MIL-STD-202, Method 208 1

CAD (KiCad official)

  • Symbol: BC858C-7-F
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: bc858c-7-f-etched.step / bc858c-7-f-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bc858c-7-f.step / bc858c-7-f.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (7 pp, sha256 9f19c49db2adb724, retrieved 2026-10-20, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF