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BC858BW

XCH(旭昌辉) · IC · SOT-323

BC858BW from XCH(旭昌辉), in a SOT-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Base input Base terminal of the PNP small-signal transistor; the device-level emitter-base breakdown voltage is -5 V minimum (VEBO, IE = -1 µA) and the BC858BW marking is 3K.
2 Emitter passive Emitter terminal of the PNP small-signal transistor; the emitter-base voltage rating VEBO is -5 V and the continuous collector current rating is -0.1 A.
3 Collector passive Collector terminal of the PNP small-signal transistor; for the BC858W the collector-base voltage VCBO is -30 V and the collector-emitter voltage VCEO is -30 V.

Key specifications

Parameter Value
Manufacturer XCH(旭昌辉)
Package SOT-323
Category
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Collector-base breakdown voltage (BC858W) VCBO -30 V IC= -10μA, IE=0 2
Collector-emitter breakdown voltage (BC858W) VCEO -30 V IC= -10mA, IB=0 2
Emitter-base breakdown voltage VEBO -5 V IE= -1μA, IC=0 2
Collector cut-off current ICBO -15 nA VCB= -30 V, IE=0 2
DC current gain (BC858BW) hFE 220 475 VCE= -5V, IC= -2mA 2
Collector-emitter saturation voltage VCE(sat) -0.65 V IC=-100mA, IB= -5mA 2
Base-emitter saturation voltage VBE(sat) -1.1 V IC=-100mA, IB= -5mA 2
Transition frequency fT 100 MHz VCE= -5V, IC= -10mA, f=100MHz 2
Collector capacitance Cob 4.5 pF VCB=-10V, f=1MHz 2
Collector-base voltage (BC858W) VCBO -30 V 1
Collector-emitter voltage (BC858W) VCEO -30 V 1
Emitter-base voltage VEBO -5 V 1
Collector current, continuous IC -0.1 A 1
Collector power dissipation PC 150 mW 1
Junction temperature TJ 150 ℃ 1
Storage temperature Tstg -65 150 ℃ 1

CAD (KiCad official)

  • Symbol: BC858BW
  • Footprint: Package_TO_SOT_SMD:SOT-323_SC-70
  • 3D model: SOT-323 (KiCad packages3D, STEP)
  • 3D model files: bc858bw-etched.step / bc858bw-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bc858bw.step / bc858bw.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: XCH(旭昌辉) datasheet (4 pp, sha256 fa3dc7d0e201cc99, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF