component
BC807K-16R
Public Made by Adomby adom
Nexperia Bipolar Transistors - BJT, SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownBC807K-16R
Nexperia · Bipolar Transistors - BJT · SOT-23
BC807K-16R from Nexperia, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | B | input | Base of the PNP transistor; emitter-base voltage limited to -5 V (VEBO) and peak base current to -200 mA. |
| 2 | E | passive | Emitter of the PNP transistor; emitter-base breakdown voltage is -5 V minimum. |
| 3 | C | passive | Collector of the PNP transistor; VCEO of -45 V, VCBO of -50 V and continuous collector current of -500 mA maximum. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Nexperia |
| Package | SOT-23 |
| Category | Transistors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| collector-base breakdown voltage | V(BR)CBO | -50 | V | IC = -100 µA; IE = 0 A | 7 | ||
| collector-emitter breakdown voltage | V(BR)CEO | -45 | V | IC = -10 mA; IB = 0 A | 7 | ||
| emitter-base breakdown voltage | V(BR)EBO | -5 | V | IE = -100 µA; IC = 0 A | 7 | ||
| collector-base cut-off current | ICBO | -100 | nA | VCB = -25 V; IE = 0 A | 7 | ||
| collector-base cut-off current | ICBO | -5 | μA | VCB = -25 V; IE = 0 A; Tj = 150 °C | 7 | ||
| emitter-base cut-off current | IEBO | -100 | nA | VEB = -5 V; IC = 0 A | 7 | ||
| DC current gain BC807K-16 | hFE | 100 | 250 | VCE = -1 V; IC = -100 mA; pulsed; tp ≤ 300 μs; δ ≤ 0.02 | 7 | ||
| DC current gain | hFE | 40 | VCE = -1 V; IC = -500 mA; pulsed; tp ≤ 300 μs; δ ≤ 0.02 | 7 | |||
| collector-emitter saturation voltage | VCEsat | -700 | mV | IC = -500 mA; IB = -50 mA | 7 | ||
| base-emitter saturation voltage | VBEsat | -1.2 | V | IC = -500 mA; IB = -50 mA | 7 | ||
| base-emitter voltage | VBE | -1.2 | V | VCE = -1 V; IC = -500 mA | 7 | ||
| transition frequency | fT | 80 | MHz | VCE = -5 V; IC = -10 mA; f = 100 MHz | 7 | ||
| collector capacitance | Cc | 7 | pF | VCB = -10 V; IE = ie = 0 A; f = 1 MHz | 7 | ||
| emitter capacitance BC807K-16 | Ce | 50 | pF | VEB = -0.5 V; IC = ic = 0 A; f = 1 MHz | 7 | ||
| collector-base voltage | VCBO | -50 | V | open emitter | 3 | ||
| collector-emitter voltage | VCEO | -45 | V | open base | 3 | ||
| emitter-base voltage | VEBO | -5 | V | open collector | 3 | ||
| collector current | IC | -500 | mA | 3 | |||
| peak collector current | ICM | -1 | A | single pulse; tp ≤ 1 ms | 3 | ||
| peak base current | IBM | -200 | mA | single pulse; tp ≤ 1 ms | 3 | ||
| total power dissipation, single-sided copper, standard footprint | Ptot | 350 | mW | Tamb ≤ 25 °C; FR4 PCB single-sided copper, tin-plated, standard footprint | 3 | ||
| total power dissipation, single-sided copper, 1 cm2 | Ptot | 575 | mW | Tamb ≤ 25 °C; FR4 PCB single-sided copper, tin-plated, collector pad 1 cm2 | 3 | ||
| total power dissipation, 4-layer, standard footprint | Ptot | 600 | mW | Tamb ≤ 25 °C; FR4 PCB 4-layer copper, tin-plated, standard footprint | 3 | ||
| total power dissipation, 4-layer, 1 cm2 | Ptot | 800 | mW | Tamb ≤ 25 °C; FR4 PCB 4-layer copper, tin-plated, collector pad 1 cm2 | 3 | ||
| junction temperature | Tj | 150 | °C | 3 | |||
| ambient temperature | Tamb | -55 | 150 | °C | 3 | ||
| storage temperature | Tstg | -65 | 150 | °C | 3 | ||
| thermal resistance junction to ambient, single-sided copper, standard footprint | Rth(j-a) | 358 | K/W | in free air; FR4 PCB single-sided copper, tin-plated, standard footprint | 5 | ||
| thermal resistance junction to ambient, single-sided copper, 1 cm2 | Rth(j-a) | 218 | K/W | in free air; FR4 PCB single-sided copper, tin-plated, collector pad 1 cm2 | 5 | ||
| thermal resistance junction to ambient, 4-layer, standard footprint | Rth(j-a) | 209 | K/W | in free air; FR4 PCB 4-layer copper, tin-plated, standard footprint | 5 | ||
| thermal resistance junction to ambient, 4-layer, 1 cm2 | Rth(j-a) | 157 | K/W | in free air; FR4 PCB 4-layer copper, tin-plated, collector pad 1 cm2 | 5 | ||
| thermal resistance junction to solder point | Rth(j-sp) | 60 | K/W | 5 |
CAD (KiCad official)
- Symbol:
BC807K-16R - Footprint:
Package_TO_SOT_SMD:SOT-23 - 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files:
bc807k-16r-etched.step/bc807k-16r-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bc807k-16r.step/bc807k-16r.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Nexperia datasheet (24 pp, sha256
4d6d5b7f1fe29d73, retrieved 2026-10-23, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).