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BC807-16-7-F

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Diodes Incorporated Bipolar (BJT), SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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BC807-16-7-F

Diodes Incorporated · Bipolar (BJT) · SOT-23

BC807-16-7-F from Diodes Incorporated, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 B input Base; bottom-left pin in the top-view pin-out drawing.
2 E passive Emitter; bottom-right pin in the top-view pin-out drawing, with Emitter-Base voltage limited to -5.0 V.
3 C passive Collector; single pin on the top side in the top-view pin-out drawing, rated for VCEO -45 V, VCBO -50 V and continuous IC -0.5 A.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOT-23
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Collector-Base Breakdown Voltage BVCBO -50 V IC = -100µA 4
Collector-Emitter Breakdown Voltage BVCEO -45 V IC = -10mA 4
Emitter-Base Breakdown Voltage BVEBO -5 V IC = -100µA 4
Collector-Emitter Cutoff Current ICES -100 nA VCE = -45V 4
Collector-Emitter Cutoff Current (TJ = +150°C) ICES -5 µA VCE = -25V, TJ = +150°C 4
Emitter-Base Cutoff Current IEBO -100 nA VEB = -5.0V 4
DC Current Gain (BC807-16) hFE 100 250 VCE = -1.0V, IC = -100mA 4
DC Current Gain (BC807-16) hFE 60 VCE = -1.0V, IC = -300mA 4
Collector-Emitter Saturation Voltage VCE(sat) -0.7 V IC = -500mA, IB = -50mA 4
Base-Emitter Voltage VBE(on) -1.2 V VCE = -1.0V, IC = -300mA 4
Gain Bandwidth Product fT 100 MHz VCE = -5.0V, IC = -10mA, f = 50MHz 4
Collector-Base Capacitance CCBO 12 pF VCB = -10V, f = 1.0MHz 4
Collector-Base Voltage VCBO -50 V 2
Collector-Emitter Voltage VCEO -45 V 2
Emitter-Base Voltage VEBO -5 V 2
Continuous Collector Current IC -0.5 A 2
Peak Collector Current ICM -1 A 2
Peak Base Current IBM -200 mA 2
Power Dissipation PD 310 mW Note 5: minimum recommended pad layout FR4, still air 2
Power Dissipation PD 350 mW Note 6: 15mm X 15mm FR4 PCB 2
Thermal Resistance, Junction to Ambient RθJA 403 °C/W Note 5: minimum recommended pad layout FR4, still air 2
Thermal Resistance, Junction to Ambient RθJA 357 °C/W Note 6: 15mm X 15mm FR4 PCB 2
Thermal Resistance, Junction to Leads RθJL 350 °C/W Note 7: junction to solder-point (end of leads) 2
Operating and Storage Temperature Range TJ,TSTG -55 150 °C 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin • Terminals: Finish, Matte Tin Plated Leads, Solderable per MIL-STD-202, Method 208 1

CAD (KiCad official)

  • Symbol: BC807-16-7-F
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: bc807-16-7-f-etched.step / bc807-16-7-f-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bc807-16-7-f.step / bc807-16-7-f.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (7 pp, sha256 cf6b12ee0aaa9051, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF