component
BC806-16HVL
Public Made by Adomby adom
Nexperia Bipolar (BJT), TO-236AB. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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BC806-16HVL
Nexperia · Bipolar (BJT) · TO-236AB
BC806-16HVL from Nexperia, in a TO-236AB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | B | passive | Base terminal; peak base current is limited to -200 mA (single pulse, tp ≤ 1 ms, Tamb = 25 °C). |
| 2 | E | passive | Emitter terminal; emitter-base voltage is limited to -8 V (VEBO, open collector, Tamb = 25 °C). |
| 3 | C | passive | Collector terminal; collector current is limited to -500 mA and collector-emitter voltage (VCEO, open base) to -80 V at Tamb = 25 °C. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Nexperia |
| Package | TO-236AB |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| collector-base voltage | VCBO | -80 | V | open emitter; Tamb = 25 °C | 3 | ||
| collector-emitter voltage | VCEO | -80 | V | open base; Tamb = 25 °C | 3 | ||
| emitter-base voltage | VEBO | -8 | V | open collector; Tamb = 25 °C | 3 | ||
| collector current | IC | -500 | mA | Tamb = 25 °C | 3 | ||
| peak collector current | ICM | -1 | A | single pulse; tp ≤ 1 ms; Tamb = 25 °C | 3 | ||
| peak base current | IBM | -200 | mA | single pulse; tp ≤ 1 ms; Tamb = 25 °C | 3 | ||
| total power dissipation | Ptot | 300 | mW | Tamb ≤ 25 °C; [1] FR4 PCB, single-sided copper, tin-plated, standard footprint | 3 | ||
| total power dissipation | Ptot | 415 | mW | Tamb ≤ 25 °C; [2] FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2 | 3 | ||
| junction temperature | Tj | 175 | °C | 3 | |||
| ambient temperature | Tamb | -55 | 175 | °C | 3 | ||
| storage temperature | Tstg | -65 | 175 | °C | 3 | ||
| thermal resistance from junction to ambient | Rth(j-a) | 500 | K/W | in free air; Tamb = 25 °C; [1] FR4 PCB, single-sided copper, tin-plated, standard footprint | 4 | ||
| thermal resistance from junction to ambient | Rth(j-a) | 363 | K/W | in free air; Tamb = 25 °C; [2] FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2 | 4 | ||
| collector-base breakdown voltage | V(BR)CBO | -80 | V | IC = -100 µA; IE = 0 A; Tamb = 25 °C | 5 | ||
| collector-emitter breakdown voltage | V(BR)CEO | -80 | V | IC = -2 mA; IE = 0 A; Tamb = 25 °C | 5 | ||
| emitter-base breakdown voltage | V(BR)EBO | -8 | V | IE = -100 µA; IC = 0 A; Tamb = 25 °C | 5 | ||
| collector-base cut-off current | ICBO | -100 | nA | VCB = -64 V; IE = 0 A; Tamb = 25 °C | 5 | ||
| collector-base cut-off current | ICBO | -5 | μA | VCB = -64 V; IE = 0 A; Tj = 150 °C | 5 | ||
| emitter-base cut-off current | IEBO | -100 | nA | VEB = -6.4 V; IC = 0 A; Tamb = 25 °C | 5 | ||
| DC current gain (BC806-16H) | hFE | 100 | 250 | VCE = -1 V; IC = -100 mA; Tamb = 25 °C; pulsed | 5 | ||
| DC current gain | hFE | 30 | VCE = -2 V; IC = -500 mA; Tamb = 25 °C; pulsed | 5 | |||
| collector-emitter saturation voltage | VCEsat | -150 | mV | IC = -100 mA; IB = -10 mA; Tamb = 25 °C; pulsed | 5 | ||
| collector-emitter saturation voltage | VCEsat | -400 | mV | IC = -500 mA; IB = -50 mA; Tamb = 25 °C; pulsed | 5 | ||
| base-emitter voltage | VBE | -1.2 | V | VCE = -1 V; IC = -500 mA; Tamb = 25 °C; pulsed | 5 | ||
| transition frequency | fT | 80 | MHz | VCE = -5 V; IC = -50 mA; f = 100 MHz; Tamb = 25 °C | 5 |
CAD (KiCad official)
- Symbol:
BC806-16HVL - Footprint:
Package_TO_SOT_SMD:SOT-23 - 3D model: TO-236AB (KiCad packages3D, STEP)
- 3D model files:
bc806-16hvl-etched.step/bc806-16hvl-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bc806-16hvl.step/bc806-16hvl.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Nexperia datasheet (16 pp, sha256
d26458870b29ac67, retrieved 2026-10-16, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# BC806-16HVL
**Nexperia** · Bipolar (BJT) · TO-236AB
BC806-16HVL from Nexperia, in a TO-236AB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | B | passive | Base terminal; peak base current is limited to -200 mA (single pulse, tp ≤ 1 ms, Tamb = 25 °C). |
| 2 | E | passive | Emitter terminal; emitter-base voltage is limited to -8 V (VEBO, open collector, Tamb = 25 °C). |
| 3 | C | passive | Collector terminal; collector current is limited to -500 mA and collector-emitter voltage (VCEO, open base) to -80 V at Tamb = 25 °C. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Nexperia |
| Package | TO-236AB |
| Category | Transistors/Thyristors |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| collector-base voltage | VCBO | | | -80 | V | open emitter; Tamb = 25 °C | 3 |
| collector-emitter voltage | VCEO | | | -80 | V | open base; Tamb = 25 °C | 3 |
| emitter-base voltage | VEBO | | | -8 | V | open collector; Tamb = 25 °C | 3 |
| collector current | IC | | | -500 | mA | Tamb = 25 °C | 3 |
| peak collector current | ICM | | | -1 | A | single pulse; tp ≤ 1 ms; Tamb = 25 °C | 3 |
| peak base current | IBM | | | -200 | mA | single pulse; tp ≤ 1 ms; Tamb = 25 °C | 3 |
| total power dissipation | Ptot | | | 300 | mW | Tamb ≤ 25 °C; [1] FR4 PCB, single-sided copper, tin-plated, standard footprint | 3 |
| total power dissipation | Ptot | | | 415 | mW | Tamb ≤ 25 °C; [2] FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2 | 3 |
| junction temperature | Tj | | | 175 | °C | | 3 |
| ambient temperature | Tamb | -55 | | 175 | °C | | 3 |
| storage temperature | Tstg | -65 | | 175 | °C | | 3 |
| thermal resistance from junction to ambient | Rth(j-a) | | | 500 | K/W | in free air; Tamb = 25 °C; [1] FR4 PCB, single-sided copper, tin-plated, standard footprint | 4 |
| thermal resistance from junction to ambient | Rth(j-a) | | | 363 | K/W | in free air; Tamb = 25 °C; [2] FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2 | 4 |
| collector-base breakdown voltage | V(BR)CBO | -80 | | | V | IC = -100 µA; IE = 0 A; Tamb = 25 °C | 5 |
| collector-emitter breakdown voltage | V(BR)CEO | -80 | | | V | IC = -2 mA; IE = 0 A; Tamb = 25 °C | 5 |
| emitter-base breakdown voltage | V(BR)EBO | -8 | | | V | IE = -100 µA; IC = 0 A; Tamb = 25 °C | 5 |
| collector-base cut-off current | ICBO | | | -100 | nA | VCB = -64 V; IE = 0 A; Tamb = 25 °C | 5 |
| collector-base cut-off current | ICBO | | | -5 | μA | VCB = -64 V; IE = 0 A; Tj = 150 °C | 5 |
| emitter-base cut-off current | IEBO | | | -100 | nA | VEB = -6.4 V; IC = 0 A; Tamb = 25 °C | 5 |
| DC current gain (BC806-16H) | hFE | 100 | | 250 | | VCE = -1 V; IC = -100 mA; Tamb = 25 °C; pulsed | 5 |
| DC current gain | hFE | 30 | | | | VCE = -2 V; IC = -500 mA; Tamb = 25 °C; pulsed | 5 |
| collector-emitter saturation voltage | VCEsat | | | -150 | mV | IC = -100 mA; IB = -10 mA; Tamb = 25 °C; pulsed | 5 |
| collector-emitter saturation voltage | VCEsat | | | -400 | mV | IC = -500 mA; IB = -50 mA; Tamb = 25 °C; pulsed | 5 |
| base-emitter voltage | VBE | | | -1.2 | V | VCE = -1 V; IC = -500 mA; Tamb = 25 °C; pulsed | 5 |
| transition frequency | fT | 80 | | | MHz | VCE = -5 V; IC = -50 mA; f = 100 MHz; Tamb = 25 °C | 5 |
## CAD (KiCad official)
- Symbol: `BC806-16HVL`
- Footprint: `Package_TO_SOT_SMD:SOT-23`
- 3D model: TO-236AB (KiCad packages3D, STEP)
- 3D model files: `bc806-16hvl-etched.step` / `bc806-16hvl-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `bc806-16hvl.step` / `bc806-16hvl.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Nexperia datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8600385556551241728) (16 pp, sha256 `d26458870b29ac67`, retrieved 2026-10-16, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/bc806-16hvl-datasheet.pdf)