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Ray Publish 0.1.0 f753fd2 9d ago

BAW56T-MS

MSKSEMI · Switching Diodes · SOT-523

BAW56T-MS from MSKSEMI, in a SOT-523. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K1 passive Cathode of the first diode in the BAW56T-MS dual common-anode pair (symbol on page 2); reverse voltage 85 V, forward current 75 mA.
2 K2 passive Cathode of the second diode in the BAW56T-MS dual common-anode pair (symbol on page 2); reverse voltage 85 V, forward current 75 mA.
3 A passive Common anode of both diodes in the BAW56T-MS (symbol on page 2); reverse voltage 85 V, forward current 75 mA per diode.

Key specifications

Parameter Value
Manufacturer MSKSEMI
Package SOT-523
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Power Dissipation PD 150 mW 2
Storage Temperature Range TSTG -55 125 °C 2
Operating Junction Temperature TJ 125 °C 2
Reverse Voltage VR 85 V 2
Forward Current IFO 75 mA 2
Reverse Breakdown Voltage VBR 85 Volts IR=1µA 2
Reverse Leakage Current IR 2 µA VR1=75V 2
Reverse Leakage Current IR 0.03 µA VR2=25V 2
Forward Voltage VF 0.715 Volts IF=1mA 2
Forward Voltage VF 0.855 Volts IF=10mA 2
Forward Voltage VF 1 Volts IF=50mA 2
Forward Voltage VF 1.25 Volts IF=150mA 2
Diode Capacitance CD 1.5 4 pF VR=0V, f=1MHz 2
Reverse Recovery Time trr 4 ns IF= IR= 10mA, IRR=0.1x IR, RL=100Ω 2

CAD (KiCad official)

  • Symbol: BAW56T-MS
  • Footprint: Package_TO_SOT_SMD:SOT-523
  • 3D model: SOT-523, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.8 mm nominal SOT-523 height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: baw56t-ms-etched.step / baw56t-ms-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); baw56t-ms.step / baw56t-ms.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MSKSEMI datasheet (4 pp, sha256 e02d2420c27745a2, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF