# BAW56-TP

**MCC Micro Commercial Components** · Switching Diodes · SOT-23

BAW56-TP from MCC Micro Commercial Components, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K1 | passive | Cathode of diode 1 (bottom-left pin in the schematic); part rated VR 75V, IF 250mA continuous. |
| 2 | K2 | passive | Cathode of diode 2 (bottom-right pin in the schematic); part rated VR 75V, IF 250mA continuous. |
| 3 | A | passive | Common anode of both diodes (top pin in the schematic); total power dissipation 350mW, peak forward surge 1.0A (t=1s). |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | MCC Micro Commercial Components |
| Package | SOT-23 |
| Category | Diodes |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse Voltage | VR |  |  | 75 | V |  | 1 |
| Continuous Current | IF |  |  | 250 | mA |  | 1 |
| Power Dissipation | PTOT |  |  | 350 | mW |  | 1 |
| Peak Forward Surge Current | IFSM |  |  | 1 | A | t=1s, Non-Repetitive | 1 |
| Maximum Instantaneous Forward Voltage | VF |  |  | 855 | mV | IFM = 10mA; TJ = 25°C; pulse test: pulse width 300 µs, duty cycle 2% | 1 |
| Maximum DC Reverse Current at Rated DC Blocking Voltage | IR |  |  | 2.5 | µA | VR=75 Volts; TJ = 25°C | 1 |
| Maximum DC Reverse Current at Rated DC Blocking Voltage | IR |  |  | 50 | µA | VR=75 Volts; TJ = 150°C | 1 |
| Operating Temperature |  | -55 |  | 150 | °C |  | 1 |
| Storage Temperature |  | -55 |  | 150 | °C |  | 1 |
| Maximum Thermal Resistance, Junction to Ambient |  |  |  | 357 | K/W | Junction to ambient | 1 |

## CAD (KiCad official)

- Symbol: `BAW56-TP`
- Footprint: `Package_TO_SOT_SMD:SOT-23`
- 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files: `baw56-tp-etched.step` / `baw56-tp-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `baw56-tp.step` / `baw56-tp.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [MCC Micro Commercial Components datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588884518862262272) (3 pp, sha256 `711360dbf1fe16a7`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/baw56-tp-datasheet.pdf)