component
BAV756S
Public Made by Adomby adom
Nexperia Switching Diodes, SOT-363. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 9d ago |
| viewers | 9d ago |
| bav756s-etched.glb | 9d ago |
| bav756s-etched.step | 9d ago |
| bav756s-hero.glb | 9d ago |
| bav756s-hero.overlay.json | 9d ago |
| bav756s.glb | 9d ago |
| bav756s.kicad_mod | 9d ago |
| bav756s.kicad_sym | 9d ago |
| bav756s.lbr | 9d ago |
| bav756s.step | 9d ago |
| package.json | 9d ago |
| page.json | 9d ago |
| README.md | 9d ago |
BAV756S
Nexperia · Switching Diodes · SOT-363
BAV756S from Nexperia, in a SOT-363. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | A1 | passive | Anode of diode 1; the per-diode limits in Table 5 apply (VR 90 V, IF 250 mA at Ts = 60 °C). |
| 2 | K2 | passive | Cathode of diode 2; the per-diode limits in Table 5 apply (VR 90 V, IF 250 mA at Ts = 60 °C). |
| 3 | A2; A3 | passive | Common anode shared by diode 2 and diode 3; the per-diode limits in Table 5 apply (VR 90 V, IF 250 mA at Ts = 60 °C). |
| 4 | K3 | passive | Cathode of diode 3; the per-diode limits in Table 5 apply (VR 90 V, IF 250 mA at Ts = 60 °C). |
| 5 | A4 | passive | Anode of diode 4; the per-diode limits in Table 5 apply (VR 90 V, IF 250 mA at Ts = 60 °C). |
| 6 | K1; K4 | passive | Common cathode shared by diode 1 and diode 4; the per-diode limits in Table 5 apply (VR 90 V, IF 250 mA at Ts = 60 °C). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Nexperia |
| Package | SOT-363 |
| Category | Diodes |
| Pins | 6 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Repetitive peak reverse voltage | VRRM | 90 | V | 2 | |||
| Reverse voltage | VR | 90 | V | 2 | |||
| Forward current (per diode) | IF | 250 | mA | Ts = 60 °C | 2 | ||
| Non-repetitive peak forward current | IFSM | 4 | A | tp = 1 µs; square wave; Tj(init) = 25 °C | 2 | ||
| Non-repetitive peak forward current | IFSM | 1 | A | tp = 1 ms; square wave; Tj(init) = 25 °C | 2 | ||
| Non-repetitive peak forward current | IFSM | 0.5 | A | tp = 1 s; square wave; Tj(init) = 25 °C | 2 | ||
| Repetitive peak forward current | IFRM | 500 | mA | 2 | |||
| Total power dissipation | Ptot | 350 | mW | Ts = 60 °C [1] | 2 | ||
| Forward current (per device) | IF | 100 | mA | Ts = 60 °C | 2 | ||
| Junction temperature | Tj | 150 | °C | 2 | |||
| Ambient temperature | Tamb | -65 | 150 | °C | 2 | ||
| Storage temperature | Tstg | -65 | 150 | °C | 2 | ||
| Thermal resistance from junction to solder point (per diode) | Rth(j-sp) | 255 | K/W | 2 | |||
| Forward voltage | VF | 715 | mV | IF = 1 mA; tp ≤ 300 µs; δ ≤ 0.02; pulsed; Tamb = 25 °C | 3 | ||
| Forward voltage | VF | 855 | mV | IF = 10 mA; tp ≤ 300 µs; δ ≤ 0.02; pulsed; Tamb = 25 °C | 3 | ||
| Forward voltage | VF | 1 | V | IF = 50 mA; tp ≤ 300 µs; δ ≤ 0.02; pulsed; Tamb = 25 °C | 3 | ||
| Forward voltage | VF | 1.25 | V | IF = 150 mA; tp ≤ 300 µs; δ ≤ 0.02; pulsed; Tamb = 25 °C | 3 | ||
| Reverse current | IR | 30 | nA | VR = 25 V; Tamb = 25 °C | 3 | ||
| Reverse current | IR | 0.5 | µA | VR = 80 V; Tamb = 25 °C | 3 | ||
| Reverse current | IR | 30 | µA | VR = 25 V; Tj = 150 °C | 3 | ||
| Reverse current | IR | 150 | µA | VR = 80 V; Tj = 150 °C | 3 | ||
| Diode capacitance | Cd | 2 | pF | VR = 0 V; f = 1 MHz; Tamb = 25 °C | 3 | ||
| Reverse recovery time | trr | 4 | ns | IF = 10 mA; IR = 10 mA; RL = 100 Ω; IR(meas) = 1 mA; Tamb = 25 °C | 3 | ||
| Peak forward recovery voltage | VFRM | 1.75 | V | IF = 10 mA; tr = 20 ns; Tamb = 25 °C | 3 |
CAD (KiCad official)
- Symbol:
BAV756S - Footprint:
Package_TO_SOT_SMD:SOT-363_SC-70-6 - 3D model: SOT-363 (KiCad packages3D, STEP)
- 3D model files:
bav756s-etched.step/bav756s-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bav756s.step/bav756s.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Nexperia datasheet (9 pp, sha256
9af4ee8d0712a350, retrieved 2026-10-18, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).