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Ray Publish 0.1.0 dea8830 7d ago

BAV70-MS

MSKSEMI · Switching Diodes · SOT-23

BAV70-MS from MSKSEMI, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A1 passive Anode of the first diode, connected to the common node on pin 3 through the diode (BAV70 column of the pin configuration drawing).
2 A2 passive Anode of the second diode, connected to the common node on pin 3 through the diode (BAV70 column of the pin configuration drawing).
3 K passive Common cathode node joining both diodes (BAV70 column of the pin configuration drawing); reverse voltage VR is rated 70 V.

Key specifications

Parameter Value
Manufacturer MSKSEMI
Package SOT-23
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Voltage (breakdown) VRB 70 V IB=100uA 3
Reverse Leakage Current IR 2.5 μA VR=70V 3
Forward Voltage VF 0.715 V IF=1mA 3
Forward Voltage VF 0.855 V IF=10mA 3
Forward Voltage VF 1 V IF=50mA 3
Reverse Recovery Time TRR 6 nS IF=IR=10mA, RL=100Ω, IRR=0 1xIR 3
Capacitance CT 1.5 pF VR=0V, f=1MHZ 3
Reverse Voltage VR 70 V Ratings at 25℃ ambient temperature 3
Power Dissipation Pd 225 mW Ratings at 25℃ ambient temperature 3
Operating junction temperature Tj 150 ℃ Ratings at 25℃ ambient temperature 3
Storage temperature range Ts -65 150 ℃ Ratings at 25℃ ambient temperature 3
Average Rectified Current IO 200 mA Ratings at 25℃ ambient temperature 3
Non-repetitive Peak Forward Current IFM 400 mA Ratings at 25℃ ambient temperature 3
Peak Forward Surge Current IFSM 2 A tp=1ms; TA=25℃ 3
Typical thermal resistance, junction to ambient RθJA 500 ℃/W Valid provided that electrodes are kept at ambient temperature 3

CAD (KiCad official)

  • Symbol: BAV70-MS
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: bav70-ms-etched.step / bav70-ms-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bav70-ms.step / bav70-ms.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MSKSEMI datasheet (6 pp, sha256 bd26d650c7c4c50a, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF