# BAT74S

**Nexperia** · Schottky Diodes · SOT-363

BAT74S from Nexperia, in a SOT-363. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | A1 | passive | Anode of diode 1; per-diode limits are VR 30 V and IF 200 mA (Table 5). |
| 2 | n.c. | unconnected | Not connected. |
| 3 | K2 | passive | Cathode of diode 2; per-diode limits are VR 30 V and IF 200 mA (Table 5). |
| 4 | A2 | passive | Anode of diode 2; per-diode limits are VR 30 V and IF 200 mA (Table 5). |
| 5 | n.c. | unconnected | Not connected. |
| 6 | K1 | passive | Cathode of diode 1; per-diode limits are VR 30 V and IF 200 mA (Table 5). |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Nexperia |
| Package | SOT-363 |
| Category | Diodes |
| Pins | 6 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse voltage (per diode) | VR |  |  | 30 | V |  | 3 |
| Forward current (per diode) | IF |  |  | 200 | mA |  | 3 |
| Repetitive peak forward current (per diode) | IFRM |  |  | 300 | mA | tp ≤ 1 s; δ ≤ 0.5 | 3 |
| Non-repetitive peak forward current (per diode) | IFSM |  |  | 600 | mA | tp < 10 ms; Tj(init) = 25 °C | 3 |
| Total power dissipation | Ptot |  |  | 240 | mW | Tamb ≤ 25 °C | 3 |
| Junction temperature | Tj |  |  | 125 | °C |  | 3 |
| Ambient temperature | Tamb | -55 |  | 125 | °C |  | 3 |
| Storage temperature | Tstg | -65 |  | 150 | °C |  | 3 |
| Reverse voltage, series connection (per device) | VR |  |  | 60 | V | series connection | 3 |
| Reverse voltage (per device; row label not printed in extract) | VR |  |  | 30 | V |  | 3 |
| Forward current (per single diode, per device) | IF |  |  | 110 | mA | per single diode [1] | 3 |
| Repetitive peak forward current (per device) | IFRM |  |  | 200 | mA | tp ≤ 1 s; δ ≤ 0.5 | 3 |
| Thermal resistance from junction to ambient (per diode) | Rth(j-a) |  |  | 416 | K/W | in free air; FR4 PCB, single-sided copper, standard footprint [1] | 4 |
| Forward voltage | VF |  |  | 240 | mV | IF = 0.1 mA; pulsed; tp = 300 µs; δ = 0.02; Tamb = 25 °C | 4 |
| Forward voltage | VF |  |  | 320 | mV | IF = 1 mA; pulsed; tp = 300 µs; δ = 0.02; Tamb = 25 °C | 4 |
| Forward voltage | VF |  |  | 400 | mV | IF = 10 mA; pulsed; tp = 300 µs; δ = 0.02; Tamb = 25 °C | 4 |
| Forward voltage | VF |  |  | 500 | mV | IF = 30 mA; pulsed; tp = 300 µs; δ = 0.02; Tamb = 25 °C | 4 |
| Forward voltage | VF |  |  | 800 | mV | IF = 100 mA; pulsed; tp = 300 µs; δ = 0.02; Tamb = 25 °C | 4 |
| Reverse current | IR |  |  | 2 | µA | VR = 25 V; pulsed; tp = 300 µs; δ = 0.02; Tamb = 25 °C | 4 |
| Diode capacitance | Cd |  |  | 10 | pF | VR = 1 V; f = 1 MHz; Tamb = 25 °C | 4 |
| Reverse recovery time | trr |  |  | 5 | ns | IF = 10 mA; IR = 10 mA; IR(meas) = 1 mA; RL = 100 Ω; Tamb = 25 °C | 4 |

## CAD (KiCad official)

- Symbol: `BAT74S`
- Footprint: `Package_TO_SOT_SMD:SOT-363_SC-70-6`
- 3D model: SOT-363 (KiCad packages3D, STEP)
- 3D model files: `bat74s-etched.step` / `bat74s-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `bat74s.step` / `bat74s.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Nexperia datasheet](https://assets.nexperia.com/documents/data-sheet/BAT74S.pdf) (9 pp, sha256 `04c8dd974cce53d0`, retrieved 2026-10-17, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/bat74s-datasheet.pdf)