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BAT6404E6327HTSA1

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Infineon Technologies Schottky Diodes, SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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BAT6404E6327HTSA1

Infineon Technologies · Schottky Diodes · SOT-23

BAT6404E6327HTSA1 from Infineon Technologies, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A1 passive Anode of diode D1 in the BAT64-04 series pair; each diode is rated for VR 40 V and IF 250 mA.
2 K2 passive Cathode of diode D2 in the BAT64-04 series pair; each diode is rated for VR 40 V and IF 250 mA.
3 K1/A2 passive Center node joining the D1 cathode and D2 anode in the series configuration; total package power dissipation is 250 mW at TS ≤ 61°C.

Key specifications

Parameter Value
Manufacturer Infineon Technologies
Package SOT-23
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Diode reverse voltage VR 40 V 2
Forward current IF 250 mA 2
Non-repetitive peak surge forward current IFSM 800 t ≤ 10ms 2
Average forward current IFAV 120 50/60Hz, sinus 2
Total power dissipation Ptot 250 mW BAT64-04, BAT64-06, BAT64-07, TS ≤ 61°C 2
Junction temperature Tj 150 °C 2
Storage temperature Tstg -55 150 °C 2
Junction - soldering point thermal resistance RthJS 355 K/W BAT64-04, BAT64-06, BAT64-07 2
Breakdown voltage V(BR) 40 V I(BR) = 10 µA 3
Reverse current IR 2 µA VR = 30 V 3
Reverse current IR 200 µA VR = 30 V, TA = 85 °C 3
Forward voltage VF 270 320 350 mV IF = 1 mA 3
Forward voltage VF 310 385 430 mV IF = 10 mA 3
Forward voltage VF 370 440 520 mV IF = 30 mA 3
Forward voltage VF 500 570 750 mV IF = 100 mA 3
Diode capacitance CT 4 6 pF VR = 1 V, f = 1 MHz 3
Reverse recovery time trr 5 ns IF = 10 mA, IR = 10 mA, measured at IR = 1 mA, RL = 100 Ω 3

CAD (KiCad official)

  • Symbol: BAT6404E6327HTSA1
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: bat6404e6327htsa1-etched.step / bat6404e6327htsa1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bat6404e6327htsa1.step / bat6404e6327htsa1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Infineon Technologies datasheet (7 pp, sha256 0eb95c2df9699b80, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF