component
BAT60JFILM
Public Made by Adomby adom
STMicroelectronics Schottky Diodes, SOD-323. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
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BAT60JFILM
STMicroelectronics · Schottky Diodes · SOD-323
BAT60JFILM from STMicroelectronics, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | STMicroelectronics |
| Package | SOD-323 |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Forward voltage drop | VF | 0.28 | 0.32 | V | Tj = 25°C, IF = 10 mA | 2 | |
| Forward voltage drop | VF | 0.35 | 0.4 | V | Tj = 25°C, IF = 100 mA | 2 | |
| Forward voltage drop | VF | 0.53 | 0.58 | V | Tj = 25°C, IF = 1 A | 2 | |
| Reverse leakage current | IR | 1 | 3 | µA | Tj = 25°C, VR = 5 V | 2 | |
| Reverse leakage current | IR | 1.3 | 4 | µA | Tj = 25°C, VR = 8 V | 2 | |
| Reverse leakage current | IR | 2 | 6 | µA | Tj = 25°C, VR = 10 V | 2 | |
| Reverse leakage current | IR | 2.5 | 7.5 | µA | Tj = 25°C, VR = 12 V | 2 | |
| Reverse leakage current | IR | 73 | 150 | µA | Tj = 80°C, VR = 8 V | 2 | |
| Repetitive peak reverse voltage | VRRM | 10 | V | 1 | |||
| Peak forward current | IF | 3 | A | δ = 0.11 | 1 | ||
| Surge non repetitive forward current | IFSM | 5 | A | tp=10ms | 1 | ||
| Power Dissipation | Ptot | 310 | mW | Ta=25°C | 1 | ||
| Storage temperature range | Tstg | -65 | 150 | °C | 1 | ||
| Maximum operating junction temperature | Tj | 150 | °C | 1 | |||
| Maximum temperature for soldering | TL | 260 | °C | during 10s | 1 | ||
| Junction to ambient thermal resistance | Rth (j-a) | 400 | °C/W | Mounted on epoxy board with recommended pad layout | 1 |
CAD (KiCad official)
- Symbol:
BAT60JFILM - Footprint:
Diode_SMD:D_SOD-323 - 3D model: SOD-323 (KiCad packages3D, STEP)
- 3D model files:
bat60jfilm-etched.step/bat60jfilm-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bat60jfilm.step/bat60jfilm.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: STMicroelectronics datasheet (5 pp, sha256
e12ca1b203afabb6, retrieved 2026-10-22, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarycathode-band convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# BAT60JFILM
**STMicroelectronics** · Schottky Diodes · SOD-323
BAT60JFILM from STMicroelectronics, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | STMicroelectronics |
| Package | SOD-323 |
| Category | Diodes |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Forward voltage drop | VF | | 0.28 | 0.32 | V | Tj = 25°C, IF = 10 mA | 2 |
| Forward voltage drop | VF | | 0.35 | 0.4 | V | Tj = 25°C, IF = 100 mA | 2 |
| Forward voltage drop | VF | | 0.53 | 0.58 | V | Tj = 25°C, IF = 1 A | 2 |
| Reverse leakage current | IR | | 1 | 3 | µA | Tj = 25°C, VR = 5 V | 2 |
| Reverse leakage current | IR | | 1.3 | 4 | µA | Tj = 25°C, VR = 8 V | 2 |
| Reverse leakage current | IR | | 2 | 6 | µA | Tj = 25°C, VR = 10 V | 2 |
| Reverse leakage current | IR | | 2.5 | 7.5 | µA | Tj = 25°C, VR = 12 V | 2 |
| Reverse leakage current | IR | | 73 | 150 | µA | Tj = 80°C, VR = 8 V | 2 |
| Repetitive peak reverse voltage | VRRM | | | 10 | V | | 1 |
| Peak forward current | IF | | | 3 | A | δ = 0.11 | 1 |
| Surge non repetitive forward current | IFSM | | | 5 | A | tp=10ms | 1 |
| Power Dissipation | Ptot | | | 310 | mW | Ta=25°C | 1 |
| Storage temperature range | Tstg | -65 | | 150 | °C | | 1 |
| Maximum operating junction temperature | Tj | | | 150 | °C | | 1 |
| Maximum temperature for soldering | TL | | | 260 | °C | during 10s | 1 |
| Junction to ambient thermal resistance | Rth (j-a) | | | 400 | °C/W | Mounted on epoxy board with recommended pad layout | 1 |
## CAD (KiCad official)
- Symbol: `BAT60JFILM`
- Footprint: `Diode_SMD:D_SOD-323`
- 3D model: SOD-323 (KiCad packages3D, STEP)
- 3D model files: `bat60jfilm-etched.step` / `bat60jfilm-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `bat60jfilm.step` / `bat60jfilm.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [STMicroelectronics datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588880598849236992) (5 pp, sha256 `e12ca1b203afabb6`, retrieved 2026-10-22, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `cathode-band convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/bat60jfilm-datasheet.pdf)