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Contents

README

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BAT54WT1G

onsemi · Schottky Barrier Diodes (SBD) · SOT-323

BAT54WT1G from onsemi, in a SOT-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 ANODE passive Anode of the Schottky diode (CASE 419 Style 2, pin 1), 30 V maximum reverse voltage and 200 mA maximum DC forward current.
2 N.C. unconnected No connect pin per CASE 419 Style 2.
3 CATHODE passive Cathode of the Schottky diode (CASE 419 Style 2, pin 3), 30 V maximum reverse voltage.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOT-323
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Breakdown Voltage V(BR)R 30 V IR = 10 µA 2
Total Capacitance CT 7.6 10 pF VR = 1.0 V, f = 1.0 MHz 2
Reverse Leakage IR 0.2 2 µAdc VR = 25 V 2
Forward Voltage VF 0.22 0.24 V IF = 0.1 mA 2
Forward Voltage VF 0.29 0.32 V IF = 1.0 mA 2
Forward Voltage VF 0.35 0.4 V IF = 10 mA 2
Forward Voltage VF 0.41 0.5 V IF = 30 mA 2
Forward Voltage VF 0.52 0.8 V IF = 100 mA 2
Reverse Recovery Time trr 5 ns IF = IR = 10 mAdc, IR(REC) = 1.0 mAdc, Figure 1 2
Reverse Voltage VR 30 V TJ = 125°C 1
Forward Power Dissipation PF 200 mW TA = 25°C 1
Power Dissipation Derating 2 mW/°C Derate above 25°C 1
Forward Current (DC) IF 200 mA 1
Non-Repetitive Peak Forward Current IFSM 600 mA tp < 10 msec 1
Repetitive Peak Forward Current IFRM 300 mA Pulse Wave = 1 sec, Duty Cycle = 66% 1
Junction Temperature TJ -55 125 °C 1
Storage Temperature Range Tstg -55 150 °C 1
Thermal Resistance, Junction-to-Ambient RθJA 285 °C/W 10 mm2 pad, 1 oz. Cu 1
Thermal Resistance, Junction-to-Ambient RθJA 216 °C/W 100 mm2 pad, 1 oz. Cu 1

CAD (KiCad official)

  • Symbol: BAT54WT1G
  • Footprint: Package_TO_SOT_SMD:SOT-323_SC-70
  • 3D model: SOT-323 (KiCad packages3D, STEP)
  • 3D model files: bat54wt1g-etched.step / bat54wt1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bat54wt1g.step / bat54wt1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (5 pp, sha256 df43b03bf5c5fc73, retrieved 2026-10-22, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF