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BAT54SWTHE3-TP

MCC Micro Commercial Components · Schottky Diodes · SOT-323

BAT54SWTHE3-TP from MCC Micro Commercial Components, in a SOT-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A1 passive Anode of the first Schottky diode of the series pair (BAT54SWTHE3, marking KL8); 30V maximum DC blocking voltage, 200mA average forward current.
2 K2 passive Cathode of the second Schottky diode of the series pair; 30V maximum DC blocking voltage, 200mA average forward current.
3 K1/A2 passive Common center node joining the cathode of the first diode and the anode of the second diode in the series configuration.

Key specifications

Parameter Value
Manufacturer MCC Micro Commercial Components
Package SOT-323
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum Reverse Breakdown Voltage V(BR) 30 V 1
Maximum DC Reverse Current at Rated DC Blocking Voltage IR 2 μA VR = 25V 1
Maximum Forward Voltage VF 240 mV IF=0.1mA 1
Maximum Forward Voltage VF 320 mV IF=1.0mA 1
Maximum Forward Voltage VF 400 mV IF=10mA 1
Maximum Forward Voltage VF 500 mV IF=30mA 1
Maximum Forward Voltage VF 800 mV IF=100mA 1
Maximum Reverse Recovery Time trr 5 ns IF=IR=10mA; Irr=0.1×IR, RL=100Ω 1
Maximum Junction Capacitance CJ 10 pF Measured at 1.0MHz, VR=1.0V, TA= 25 °C 1
Maximum Recurrent Peak Reverse Voltage 30 V 1
Maximum RMS Voltage 21 V 1
Maximum DC Blocking Voltage VR 30 V 1
Average Forward Current IF(AV) 200 mA 1
Peak Forward Surge Current IFSM 600 mA 8.3ms 1
Repetitive Peak Forward Current IFRM 300 mA tp≤1s; Duty Cycle≤50% 1
Power Dissipation Pd 200 mW TA= 25 °C 1
Operating Junction Temperature Range -55 125 °C 1
Storage Temperature Range -55 150 °C 1
Thermal Resistance Junction to Ambient 500 °C/W Junction to Ambient 1

CAD (KiCad official)

  • Symbol: BAT54SWTHE3-TP
  • Footprint: Package_TO_SOT_SMD:SOT-323_SC-70
  • 3D model: SOT-323 (KiCad packages3D, STEP)
  • 3D model files: bat54swthe3-tp-etched.step / bat54swthe3-tp-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bat54swthe3-tp.step / bat54swthe3-tp.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MCC Micro Commercial Components datasheet (3 pp, sha256 3c533a7280e1b83a, retrieved 2026-10-21, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF