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BAT54S RFG

Taiwan Semiconductor(Taiwan Semicon) · Schottky Barrier Diodes (SBD) · SOT-23

BAT54S RFG from Taiwan Semiconductor(Taiwan Semicon), in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A1 passive Anode of the first Schottky diode (bottom-left pin in the BAT54S pin configuration drawing); 30V minimum reverse breakdown, 200mA forward continuous current.
2 K2 passive Cathode of the second Schottky diode (bottom-right pin in the BAT54S pin configuration drawing); 30V minimum reverse breakdown, 200mA forward continuous current.
3 K1/A2 passive Common center node joining the cathode of the first diode to the anode of the second diode in the series BAT54S configuration (top pin in the drawing).

Key specifications

Parameter Value
Manufacturer Taiwan Semiconductor(Taiwan Semicon)
Package SOT-23
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Breakdown Voltage V(BR) 30 V IR=100µA 1
Forward Voltage VF 0.24 V IF=0.1mA 1
Forward Voltage VF 0.32 V IF=1mA 1
Forward Voltage VF 0.4 V IF=10mA 1
Forward Voltage VF 0.5 V IF=30mA 1
Forward Voltage VF 1 V IF=100mA 1
Reverse Current IR 2 µA VR=25V 1
Total Capacitance CT 10 pF VR=1V, f=1.0MHz 1
Reverse Recovery Time trr 5 ns IF=IR=10mA, RL=100Ω, IRR=1mA 1
Peak Repetitive Reverse Voltage VRRM 30 V TA=25℃ 1
Working Peak Reverse Voltage VRWM 30 V TA=25℃ 1
DC Reverse Voltage VR 30 V TA=25℃ 1
Forward Continuous Current IF 200 mA 1
Repetitive Peak Forward Current IFRM 300 mA tp≤1S;δ≤0.5 1
Forward Surge Current IFSM 600 mA t<1.0s 1
Thermal Resistance, Junction to Ambient RθJA 500 °C/W 1
Operating and Storage Temperature Tj, TSTG -55 125 °C 1

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin - Matte Tin (Sn) lead finish with Nickel (Ni) underplate - Pb free and RoHS compliant 1

CAD (KiCad official)

  • Symbol: BAT54S RFG
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: bat54s-rfg-etched.step / bat54s-rfg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bat54s-rfg.step / bat54s-rfg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Taiwan Semiconductor(Taiwan Semicon) datasheet (5 pp, sha256 d05103fd73fa8731, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF