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Contents

README

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BAT1704WH6327XTSA1

Infineon Technologies · Schottky Diodes · SOT-323-3

BAT1704WH6327XTSA1 from Infineon Technologies, in a SOT-323-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive Terminal of series Schottky diode D1 at the outer end of the pair, with the other end of D1 connected to common pin 3; the diode pair is rated 4 V reverse voltage and 130 mA forward current.
2 2 passive Terminal of series Schottky diode D2 at the outer end of the pair, with the other end of D2 connected to common pin 3; the diode pair is rated 4 V reverse voltage and 130 mA forward current.
3 3 passive Common series junction node between diodes D1 and D2 (series pair configuration, marking 54s).

Key specifications

Parameter Value
Manufacturer Infineon Technologies
Package SOT-323-3
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Diode reverse voltage VR 4 V 2
Forward current IF 130 mA 2
Total power dissipation PTOT 150 mW TS ≤ 100 °C 2
Junction temperature TJ 150 °C 2
Operating temperature TOP -55 125 °C 2
Storage temperature TSTG -55 150 °C 2
Breakdown voltage VBR 4 V IR = 10 μA 3
Reverse current IR 0.25 μA VR = 3 V 3
Reverse current IR 1.25 μA VR = 3 V, TA = 60 °C 3
Reverse current IR 10 μA VR = 4 V 3
Forward voltage VF 0.2 0.27 0.35 V IF = 0.1 mA 3
Forward voltage VF 0.25 0.34 0.45 V IF = 1 mA 3
Forward voltage VF 0.35 0.42 0.6 V IF = 10 mA 3
Forward voltage matching ΔVF 20 mV IF = 1 mA 3
Differential forward resistance RF 8 15 Ω IF = 5 mA 3
Capacitance C 0.4 0.61 0.7 pF VR = 0 V, f = 1 MHz 3
Thermal resistance (junction - soldering point) RthJS 330 K/W TS = 100 °C 6

CAD (KiCad official)

  • Symbol: BAT1704WH6327XTSA1
  • Footprint: Package_TO_SOT_SMD:SOT-323_SC-70
  • 3D model: SOT-323-3 (KiCad packages3D, STEP)
  • 3D model files: bat1704wh6327xtsa1-etched.step / bat1704wh6327xtsa1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bat1704wh6327xtsa1.step / bat1704wh6327xtsa1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Infineon Technologies datasheet (10 pp, sha256 071f14f08bc3380f, retrieved 2026-10-21, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF