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BAS70TW-TP

MCC(Micro Commercial Components) · Schottky Barrier Diodes (SBD) · SOT-363

BAS70TW-TP from MCC(Micro Commercial Components), in a SOT-363. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A1 passive Anode of diode 1 (pin 1 is the dot-marked corner), paired with cathode C1 on pin 6; 70V rated, IF 70mA average.
2 A2 passive Anode of diode 2, paired with cathode C2 on pin 5; 70V rated, IF 70mA average.
3 A3 passive Anode of diode 3, paired with cathode C3 on pin 4; 70V rated, IF 70mA average.
4 C3 passive Cathode of diode 3, paired with anode A3 on pin 3; 70V minimum reverse breakdown at IR=10µA.
5 C2 passive Cathode of diode 2, paired with anode A2 on pin 2; 70V minimum reverse breakdown at IR=10µA.
6 C1 passive Cathode of diode 1, paired with anode A1 on pin 1; 70V minimum reverse breakdown at IR=10µA.

Key specifications

Parameter Value
Manufacturer MCC(Micro Commercial Components)
Package SOT-363
Category Diodes
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum Forward Voltage VF 410 mV IF=1.0mA 1
Maximum Forward Voltage VF 1000 mV IF=15mA 1
Maximum DC Reverse Current At Rated DC Blocking Voltage IR 0.1 μA VR = 50V 1
Minimum Reverse Breakdown Voltage V(BR) 70 V IR = 10µA 1
Maximum Junction Capacitance CT 2 pF Measured at 1.0MHz, VR=0.0V 1
Maximum Reverse Recovery Time trr 5 nS IR=IF=10mA,Irr=0.1XIR, RL=100Ω 1
Average Forward Current IF 70 mA 1
Peak Forward Surge Current IFSM 100 mA <1.0s 1
Power Dissipation Pd 200 mW 1
Maximum Recurrent Peak Reverse Voltage 70 V 1
Maximum DC Blocking Voltage 70 V 1
Operating Junction Temperature Range -55 125 °C 1
Storage Temperature Range -55 150 °C 1
Thermal Resistance Junction to Ambient 500 °C/W Junction to ambient 1

CAD (KiCad official)

  • Symbol: BAS70TW-TP
  • Footprint: Package_TO_SOT_SMD:SOT-363_SC-70-6
  • 3D model: SOT-363 (KiCad packages3D, STEP)
  • 3D model files: bas70tw-tp-etched.step / bas70tw-tp-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bas70tw-tp.step / bas70tw-tp.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MCC(Micro Commercial Components) datasheet (3 pp, sha256 2d6a4546cc55b2a0, retrieved 2026-10-30, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF