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BAS7006E6327HTSA1

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Infineon Technologies Schottky Barrier Diodes (SBD), SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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BAS7006E6327HTSA1

Infineon Technologies · Schottky Barrier Diodes (SBD) · SOT-23

BAS7006E6327HTSA1 from Infineon Technologies, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K1 passive Cathode of diode D1 in the BAS70-06 common-anode pair, rated for VR = 70 V and IF = 70 mA.
2 K2 passive Cathode of diode D2 in the BAS70-06 common-anode pair, rated for VR = 70 V and IF = 70 mA.
3 A passive Common anode of diodes D1 and D2 in the BAS70-06 configuration, with total power dissipation of 250 mW (TS ≤ 48 °C).

Key specifications

Parameter Value
Manufacturer Infineon Technologies
Package SOT-23
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Diode reverse voltage VR 70 V 2
Forward current IF 70 mA 2
Non-repetitive peak surge forward current IFSM 100 t ≤ 10ms 2
Total power dissipation Ptot 250 mW BAS70-04, BAS70-06, TS ≤ 48 °C 2
Junction temperature TJ 150 °C 2
Operating temperature range Top -55 125 °C 2
Storage temperature TStg -55 150 °C 2
Junction - soldering point RthJS 410 K/W BAS70-04, BAS70-06 3
Breakdown voltage V(BR) 70 V I(BR) = 10 µA 3
Reverse current IR 0.1 µA VR = 50 V 3
Forward voltage VF 300 375 410 mV IF = 1 mA 3
Forward voltage VF 600 705 750 mV IF = 10 mA 3
Forward voltage VF 720 880 1000 mV IF = 15 mA 3
Forward voltage matching ∆ VF 20 mV IF = 10 mA 3
Diode capacitance CT 1.5 2 pF VR = 0, f = 1 MHz 4
Charge carrier life time τrr 100 ps IF = 25 mA 4

CAD (KiCad official)

  • Symbol: BAS7006E6327HTSA1
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: bas7006e6327htsa1-etched.step / bas7006e6327htsa1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bas7006e6327htsa1.step / bas7006e6327htsa1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Infineon Technologies datasheet (24 pp, sha256 761f409af8e9782c, retrieved 2026-10-30, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF