component
BAS70-04W
Public Made by Adomby adom
Nexperia Schottky Barrier Diodes (SBD), SOT-323-3. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownBAS70-04W
Nexperia · Schottky Barrier Diodes (SBD) · SOT-323-3
BAS70-04W from Nexperia, in a SOT-323-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | A1 | passive | Anode of diode 1; diodes are rated for VR up to 70 V and IF up to 70 mA. |
| 2 | K2 | passive | Cathode of diode 2; diodes are rated for VR up to 70 V and IF up to 70 mA. |
| 3 | K1; A2 | passive | Common node joining cathode of diode 1 and anode of diode 2 (series configuration); rated VR up to 70 V and IF up to 70 mA per diode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Nexperia |
| Package | SOT-323-3 |
| Category | Diodes |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Forward voltage | VF | 410 | mV | IF = 1 mA; tp ≤ 300 µs; δ ≤ 0.02; pulsed; Tamb = 25 °C | 3 | ||
| Forward voltage | VF | 750 | mV | IF = 10 mA; tp ≤ 300 µs; δ ≤ 0.02; pulsed; Tamb = 25 °C | 3 | ||
| Forward voltage | VF | 1 | V | IF = 15 mA; tp ≤ 300 µs; δ ≤ 0.02; pulsed; Tamb = 25 °C | 3 | ||
| Reverse current | IR | 100 | nA | VR = 50 V; Tamb = 25 °C | 3 | ||
| Reverse current | IR | 10 | µA | VR = 70 V; Tamb = 25 °C | 3 | ||
| Diode capacitance | Cd | 2 | pF | VR = 0 V; f = 1 MHz; Tamb = 25 °C | 3 | ||
| Reverse voltage | VR | 70 | V | Tj = 25 °C | 2 | ||
| Forward current | IF | 70 | mA | 2 | |||
| Repetitive peak forward current | IFRM | 70 | mA | tp ≤ 1 s; δ ≤ 0.5 | 2 | ||
| Non-repetitive peak forward current | IFSM | 100 | mA | tp ≤ 10 ms; Tj(init) = 25 °C | 2 | ||
| Junction temperature | Tj | 150 | °C | 2 | |||
| Ambient temperature | Tamb | -65 | 150 | °C | 2 | ||
| Storage temperature | Tstg | -65 | 150 | °C | 2 | ||
| Thermal resistance from junction to ambient | Rth(j-a) | 500 | K/W | in free air; device mounted on FR4 PCB, single-sided copper, tin-plated, standard footprint | 2 |
CAD (KiCad official)
- Symbol:
BAS70-04W - Footprint:
Package_TO_SOT_SMD:SOT-323_SC-70 - 3D model: SOT-323-3 (KiCad packages3D, STEP)
- 3D model files:
bas70-04w-etched.step/bas70-04w-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bas70-04w.step/bas70-04w.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Nexperia datasheet (8 pp, sha256
55066e3fc1dacd6d, retrieved 2026-10-22, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).