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BAS40DW-04-TP

MCC(Micro Commercial Components) · Schottky Barrier Diodes (SBD) · SOT-363

BAS40DW-04-TP from MCC(Micro Commercial Components), in a SOT-363. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A1 passive Anode A1 of the BAS40DW-04 internal structure, bottom-left pin in the datasheet drawing; Schottky diode rated 40V reverse, 200mA average forward current.
2 C1 passive Cathode C1 of the BAS40DW-04 internal structure, bottom-middle pin in the drawing; diode rated 40V, VF 380mV at 1mA.
3 AC2 passive Common anode/cathode node AC2 of the BAS40DW-04 internal structure, bottom-right pin in the drawing; diode rated 40V reverse.
4 A2 passive Anode A2 of the BAS40DW-04 internal structure, top-right pin in the drawing; diode rated 40V reverse, 200mA average forward current.
5 C2 passive Cathode C2 of the BAS40DW-04 internal structure, top-middle pin in the drawing; diode rated 40V, IR 0.2µA at VR=30V.
6 AC1 passive Common anode/cathode node AC1 of the BAS40DW-04 internal structure, top-left pin in the drawing; diode rated 40V reverse.

Key specifications

Parameter Value
Manufacturer MCC(Micro Commercial Components)
Package SOT-363
Category Diodes
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum Forward Voltage VF 380 mV IF=1.0mA 1
Maximum Forward Voltage VF 1000 mV IF=40mA 1
Maximum DC Reverse Current IR 0.2 µA VR = 30V 1
Minimum Reverse Breakdown Voltage V(BR) 40 V IR = 10µA 1
Maximum Junction Capacitance CT 5 pF Measured at 1.0MHz, VR=0.0V 1
Maximum Reverse Recovery Time trr 5 nS IF=10mA, IR=IF=1mA, RL=100Ω 1
Maximum Recurrent Peak Reverse Voltage 40 V 1
Maximum DC Blocking Voltage 40 V 1
Average Forward Current IF 200 mA 1
Power Dissipation Pd 200 mW 1
Operating Junction Temperature Range TJ -55 125 °C 1
Storage Temperature Range Tstg -55 125 °C 1
Thermal Resistance Junction to Ambient RθJA 500 °C/W Junction to Ambient 1

CAD (KiCad official)

  • Symbol: BAS40DW-04-TP
  • Footprint: Package_TO_SOT_SMD:SOT-363_SC-70-6
  • 3D model: SOT-363 (KiCad packages3D, STEP)
  • 3D model files: bas40dw-04-tp-etched.step / bas40dw-04-tp-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bas40dw-04-tp.step / bas40dw-04-tp.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MCC(Micro Commercial Components) datasheet (3 pp, sha256 735b93c05d6e4f09, retrieved 2026-10-24, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF