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BAS4005E6433

Infineon Technologies · Schottky Barrier Diodes (SBD) · SOT-23

BAS4005E6433 from Infineon Technologies, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model). Symbol and footprint from KiCad-official CAD; the 3D model is generated from the datasheet's package dimensions.

Pinout

Pin Name Type Function
1 A1 passive Anode of diode D1 in the BAS40-05 common-cathode pair, which has VR = 40 V and IF = 120 mA maximum.
2 A2 passive Anode of diode D2 in the BAS40-05 common-cathode pair, which has VR = 40 V and IF = 120 mA maximum.
3 K passive Common cathode of D1 and D2 in the BAS40-05; total power dissipation is 250 mW at TS ≤ 31 °C.

Key specifications

Parameter Value
Manufacturer Infineon Technologies
Package SOT-23
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Breakdown voltage V(BR) 40 V I(BR) = 10 µA 3
Reverse current IR 1 µA VR = 30 V 3
Forward voltage VF 250 310 380 mV IF = 1 mA 3
Forward voltage VF 350 450 500 mV IF = 10 mA 3
Forward voltage VF 600 720 1000 mV IF = 40 mA 3
Forward voltage matching ∆VF 20 IF = 10 mA 3
Diode capacitance CT 3 5 pF VR = 0, f = 1 MHz 3
Differential forward resistance RF 10 Ω IF = 10 mA, f = 10 kHz 3
Charge carrier life time τrr 100 ps IF = 25 mA 3
Diode reverse voltage VR 40 V TA = 25 °C 2
Forward current IF 120 mA TA = 25 °C 2
Non-repetitive peak surge forward current IFSM 200 t ≤ 10ms 2
Total power dissipation Ptot 250 mW BAS40-05, TS ≤ 31°C 2
Junction temperature Tj 150 °C 2
Operating temperature range Top -55 150 °C 2
Storage temperature Tstg -55 150 °C 2
Thermal resistance junction - soldering point RthJS 475 K/W BAS40-05 2

CAD (land: KiCad; 3D: generated from the datasheet)

  • Symbol: BAS4005E6433
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23, generated on the KiCad land (body 1.3 x 2.9 mm, terminals on the pads, 1.0 mm tall, datasheet A, nominal). KiCad's stock model for this land is taller than the datasheet allows, so the model is generated from the datasheet drawing; the dimensions come from the datasheet drawing where it was read and are defaults otherwise (see provenance.model_3d_generated), not the manufacturer's CAD (STEP)
  • 3D model files: bas4005e6433-etched.step / bas4005e6433-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bas4005e6433.step / bas4005e6433.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Infineon Technologies datasheet (15 pp, sha256 8cde61e18bbdc846, retrieved 2026-11-12, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: land: KiCad official libraries (CC-BY-SA 4.0); 3D: generated from the datasheet's package dimensions (provenance.model_3d_generated).

Datasheet PDF