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BAS21VD

Public Made by Adom

by adom

Nexperia Switching Diodes, TSOP6. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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BAS21VD

Nexperia · Switching Diodes · TSOP6

BAS21VD from Nexperia, in a TSOP6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K1 passive Cathode of diode 1; per-diode limits are VR 200 V and IF 200 mA.
2 K2 passive Cathode of diode 2; per-diode limits are VR 200 V and IF 200 mA.
3 K3 passive Cathode of diode 3; per-diode limits are VR 200 V and IF 200 mA.
4 A3 passive Anode of diode 3; per-diode limits are VR 200 V and IF 200 mA.
5 A2 passive Anode of diode 2; per-diode limits are VR 200 V and IF 200 mA.
6 A1 passive Anode of diode 1; per-diode limits are VR 200 V and IF 200 mA.

Key specifications

Parameter Value
Manufacturer Nexperia
Package TSOP6
Category Diodes
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Repetitive peak reverse voltage VRRM 250 V 2
Reverse voltage VR 200 V 2
Forward current IF 200 mA pulsed; tp ≤ 300 µs; δ ≤ 0.02 2
Repetitive peak forward current IFRM 1 A tp ≤ 1 ms; δ ≤ 25 % 2
Non-repetitive peak forward current IFSM 16 A tp = 10 µs; Tj(init) = 25 °C; square wave 2
Non-repetitive peak forward current IFSM 8 A tp = 100 µs; Tj(init) = 25 °C; square wave 2
Non-repetitive peak forward current IFSM 2 A tp = 10 ms; Tj(init) = 25 °C; square wave 2
Total power dissipation Ptot 250 mW Tamb ≤ 25 °C; FR4 PCB, standard footprint (note [1]) 3
Total power dissipation Ptot 295 mW Tamb ≤ 25 °C; FR4 PCB, mounting pad for cathode 1 cm² (note [2]) 3
Storage temperature Tstg -65 150 °C 3
Junction temperature Tj 150 °C 3
Ambient temperature Tamb -65 150 °C 3
Thermal resistance from junction to ambient Rth(j-a) 500 K/W in free air; FR4 PCB, standard footprint (note [1]) 3
Thermal resistance from junction to ambient Rth(j-a) 425 K/W in free air; FR4 PCB, mounting pad for cathode 1 cm² (note [2]) 3
Thermal resistance from junction to solder point Rth(j-sp) 140 K/W soldering point of cathode tab (note [3]) 3
Forward voltage VF 1 V IF = 100 mA; Tamb = 25 °C 3
Forward voltage VF 1.25 V IF = 200 mA; Tamb = 25 °C 3
Reverse current IR 25 100 nA VR = 200 V; pulsed; tp ≤ 300 µs; δ ≤ 0.02; Tamb = 25 °C 3
Reverse current IR 100 µA VR = 200 V; Tj = 150 °C 3
Diode capacitance Cd 0.6 5 pF f = 1 MHz; VR = 0 V; Tamb = 25 °C 3
Reverse recovery time trr 16 50 ns IF = 30 mA; IR = 30 mA; Tamb = 25 °C; RL = 100 Ω; IR(meas) = 3 mA 3

CAD (KiCad official)

  • Symbol: BAS21VD
  • Footprint: Package_SO:TSOP-6_1.65x3.05mm_P0.95mm
  • 3D model: TSOP6 (KiCad packages3D, STEP)
  • 3D model files: bas21vd-etched.step / bas21vd-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bas21vd.step / bas21vd.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Nexperia datasheet (11 pp, sha256 9e9b6b44c44c993f, retrieved 2026-10-19, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF