# BAS20HE3-TP

**MCC Micro Commercial Components** · Switching Diodes · SOT-23

BAS20HE3-TP from MCC Micro Commercial Components, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | A | passive | Anode of the single diode per the internal structure drawing; the drawing shows it connected to the diode, which is rated for 200V VR/VRRM and 400mA IFM for BAS20HE3. |
| 2 | NC | unconnected | No internal connection; pin 2 is shown in the internal structure drawing with no diode connection. |
| 3 | K | passive | Cathode of the single diode per the internal structure drawing; the diode is rated for 200V continuous reverse voltage for BAS20HE3. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | MCC Micro Commercial Components |
| Package | SOT-23 |
| Category | Diodes |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Continuous Reverse Voltage | VR |  |  | 200 | V | TA=25°C, BAS20HE3 row | 1 |
| Repetitive Peak Reverse Voltage | VRRM |  |  | 200 | V | BAS20HE3 row | 1 |
| Average Rectified Forward Current | IF(AV) |  |  | 225 | mA |  | 1 |
| Forward DC Current | IFM |  |  | 400 | mA |  | 1 |
| Repetitive Peak Forward Current | IFRM |  |  | 625 | mA |  | 1 |
| Non-Repetitive Peak Forward Surge Current | IFSM |  |  | 9 | A | t=1us | 1 |
| Non-Repetitive Peak Forward Surge Current | IFSM |  |  | 0.5 | A | t=1s | 1 |
| Power Dissipation | PTOT |  |  | 350 | mW | TA=25°C (Note 2: mounted on FR-4 board with recommended pad layout) | 1 |
| Forward Voltage | VF |  |  | 1 | V | IF=100mA | 2 |
| Forward Voltage | VF |  |  | 1.25 | V | IF=200mA | 2 |
| Reverse Current | IR |  |  | 100 | nA | VR=VRmax | 2 |
| Reverse Current | IR |  |  | 100 | μA | VR=VRmax, TJ=150°C | 2 |
| Dynamic Forward Resistance | rf |  |  | 5 | Ω | IF=100mA | 2 |
| Junction Capacitance | CJ |  |  | 5 | pF | VR = 0V, f = 1MHz | 2 |
| Reverse Recovery Time | trr |  |  | 50 | ns | IF=IR=30mA, Irr=0.1×IR, RL=100Ω | 2 |
| Thermal Resistance, Junction to Ambient |  |  | 357 |  | °C/W | Junction to ambient (Note 2: mounted on FR-4 board with recommended pad layout) | 1 |
| Operating Junction Temperature Range |  | -65 |  | 150 | °C |  | 1 |
| Storage Temperature Range |  | -65 |  | 150 | °C |  | 1 |

## CAD (KiCad official)

- Symbol: `BAS20HE3-TP`
- Footprint: `Package_TO_SOT_SMD:SOT-23`
- 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files: `bas20he3-tp-etched.step` / `bas20he3-tp-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `bas20he3-tp.step` / `bas20he3-tp.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [MCC Micro Commercial Components datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8602713244364648448) (4 pp, sha256 `6cc69218c2c9db73`, retrieved 2026-10-17, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/bas20he3-tp-datasheet.pdf)