# BAS170WE6327

**Infineon Technologies** · Schottky Diodes · SOD-323

BAS170WE6327 from Infineon Technologies, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Infineon Technologies |
| Package | SOD-323 |
| Category | Diodes |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Non-repetitive peak surge forward current | IFSM |  |  | 100 | mA | t ≤ 10 ms | 2 |
| Diode reverse voltage | VR |  |  | 70 | V |  | 2 |
| Forward current | IF |  |  | 70 | mA |  | 2 |
| Total power dissipation | Ptot |  |  | 250 | mW | BAS70-04S/W/-06W, BAS170W, TS ≤ 97 °C | 2 |
| Junction temperature | TJ |  |  | 150 | °C |  | 2 |
| Operating temperature range | Top | -55 |  | 125 | °C |  | 2 |
| Storage temperature | TStg | -55 |  | 150 | °C |  | 2 |
| Junction - soldering point | RthJS |  |  | 190 | K/W | BAS170W | 3 |
| Breakdown voltage | V(BR) | 70 |  |  | V | I(BR) = 10 µA | 3 |
| Reverse current | IR |  |  | 0.1 | µA | VR = 50 V | 3 |
| Forward voltage | VF | 300 | 600 | 720 | mV | IF = 1 mA | 3 |
| Forward voltage | VF | 375 | 705 | 880 | mV | IF = 10 mA | 3 |
| Forward voltage | VF | 410 | 750 | 1000 | mV | IF = 15 mA | 3 |
| Forward voltage matching | ∆VF |  |  | 20 | mV | IF = 10 mA | 3 |
| Diode capacitance | CT |  | 1.5 | 2 | pF | VR = 0, f = 1 MHz | 4 |
| Charge carrier life time | τrr |  |  | 100 | ps | IF = 25 mA | 4 |

## CAD (KiCad official)

- Symbol: `BAS170WE6327`
- Footprint: `Diode_SMD:D_SOD-323`
- 3D model: SOD-323 (KiCad packages3D, STEP)
- 3D model files: `bas170we6327-etched.step` / `bas170we6327-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `bas170we6327.step` / `bas170we6327.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Infineon Technologies datasheet](docs/bas170we6327-datasheet.pdf) (24 pp, sha256 `64da604e9801b21b`, retrieved 2026-11-05, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `cathode-band convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/bas170we6327-datasheet.pdf)