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BAS116 RFG

Taiwan Semiconductor · Switching Diodes · SOT-23

BAS116 RFG from Taiwan Semiconductor, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A passive Anode of the single switching diode (bottom-left lead in the page-1 schematic); diode is rated 75V VRRM and 200mA mean forward current.
2 NC unconnected No internal connection; the lead is shown with no die connection in the page-1 schematic.
3 K passive Cathode of the single switching diode (top lead in the page-1 schematic); reverse voltage 75V minimum at IR=100µA.

Key specifications

Parameter Value
Manufacturer Taiwan Semiconductor
Package SOT-23
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Forward voltage VF 0.9 V IF = 1.0mA, TJ = 25°C 2
Forward voltage VF 1 V IF = 10mA, TJ = 25°C 2
Forward voltage VF 1.1 V IF = 50mA, TJ = 25°C 2
Forward voltage VF 1.25 V IF = 150mA, TJ = 25°C 2
Reverse voltage VR 75 V IR=100µA, TJ = 25°C 2
Reverse current IR 5 nA VR=75V, TJ = 25°C 2
Reverse current IR 80 nA VR=75V, TJ = 150°C 2
Junction capacitance CJ 2 pF f=1 MHz, VR=0V 2
Reverse recovery time trr 3 µs IF=10mA, IR=10mA, RL=100Ω, Irr=1mA 2
Power dissipation PD 225 mW 1
Repetitive peak reverse voltage VRRM 75 V 1
Mean forward current IO 200 mA 1
Non-repetitive peak forward surge current IFSM 500 mA @ t=1s 1
Junction temperature range TJ -55 150 °C 1
Storage temperature range TSTG -55 150 °C 1
Thermal resistance, junction to ambient RθJA 330 °C/W Junction to ambient; valid provided electrodes are kept at ambient temperature (Note 1) 1

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin ● Terminal: Matte tin plated leads, solderable per J-STD-002 ● Meet JESD 201 class 1A whisker test 1

CAD (KiCad official)

  • Symbol: BAS116 RFG
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: bas116-rfg-etched.step / bas116-rfg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bas116-rfg.step / bas116-rfg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Taiwan Semiconductor datasheet (5 pp, sha256 1a0487ad74684722, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF