# BAP51-02-TP

**MCC(Micro Commercial Components)** · Diodes - General Purpose · SOD-523

BAP51-02-TP from MCC(Micro Commercial Components), in a SOD-523. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | MCC(Micro Commercial Components) |
| Package | SOD-523 |
| Category | Diodes |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Continuous Reverse Voltage | VR |  |  | 60 | V |  | 1 |
| Forward Current | IF |  |  | 50 | mA |  | 1 |
| Power Dissipation | PD |  |  | 715 | mW | TA=90°C | 1 |
| Storage Temperature Range |  | -65 |  | 150 | °C |  | 1 |
| Operating Junction Temperature Range |  | -65 |  | 150 | °C |  | 1 |
| Thermal Resistance Junction to Solder Point |  |  |  | 85 | °C/W | Junction to Solder Point | 1 |
| Continuous Reverse Voltage | VR | 50 |  |  | V | IR=10μA | 2 |
| Forward Voltage | VF |  |  | 1.1 | V | IF=50mA | 2 |
| Reverse Current | IR |  |  | 100 | nA | VR=50V | 2 |
| Diode Capacitance | Cd1 |  |  | 0.4 | pF | VR=0V,f=1MHz | 2 |
| Diode Capacitance | Cd2 |  |  | 0.55 | pF | VR=1V,f=1MHz | 2 |
| Diode Capacitance | Cd3 |  |  | 0.35 | pF | VR=5V,f=1MHz | 2 |
| Diode Forward Resistance | RD |  |  | 9 | Ω | IF=0.5mA,f=100MHz | 2 |
| Diode Forward Resistance | RD |  |  | 6.5 | Ω | IF=1.0mA,f=100MHz | 2 |
| Diode Forward Resistance | RD |  |  | 2.5 | Ω | IF=10mA,f=100MHz | 2 |

## CAD (KiCad official)

- Symbol: `BAP51-02-TP`
- Footprint: `Diode_SMD:D_SOD-523`
- 3D model: SOD-523 (KiCad packages3D, STEP)
- 3D model files: `bap51-02-tp-etched.step` / `bap51-02-tp-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `bap51-02-tp.step` / `bap51-02-tp.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [MCC(Micro Commercial Components) datasheet](docs/bap51-02-tp-datasheet.pdf) (4 pp, sha256 `424e8040513cf9c2`, retrieved 2026-10-22, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `cathode-band convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/bap51-02-tp-datasheet.pdf)