component

BAL99

Public Made by Adom

by adom

Nexperia Switching Diodes, SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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BAL99

Nexperia · Switching Diodes · SOT-23

BAL99 from Nexperia, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 n.c. unconnected Pin 1 is not connected internally and is listed as n.c. in the pinning table.
2 K passive Cathode of the high-speed switching diode; the device limits are a continuous reverse voltage (VR) of max. 70 V and a forward current (IF) of max. 215 mA.
3 A passive Anode of the high-speed switching diode; the device limits are a continuous reverse voltage (VR) of max. 70 V and a forward current (IF) of max. 215 mA.

Key specifications

Parameter Value
Manufacturer Nexperia
Package SOT-23
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Repetitive peak reverse voltage VRRM 70 V 2
Reverse voltage VR 70 V 2
Forward current IF 215 mA footnote [1]: device mounted on FR4 PCB, single-sided copper, tin-plated, standard footprint 2
Non-repetitive peak forward current IFSM 4 A tp = 1 µs; square wave; Tj(init) = 25 °C 2
Non-repetitive peak forward current IFSM 1 A tp = 1 ms; square wave; Tj(init) = 25 °C 2
Non-repetitive peak forward current IFSM 0.5 A tp = 1000 ms; square wave; Tj(init) = 25 °C 2
Repetitive peak forward current IFRM 500 mA 2
Total power dissipation Ptot 250 mW Tamb = 25 °C; footnote [1]: device mounted on FR4 PCB, single-sided copper, tin-plated, standard footprint 2
Junction temperature Tj 150 °C 2
Storage temperature Tstg -65 150 °C 2
Thermal resistance from junction to ambient Rth(j-a) 500 K/W in free air; footnote [1]: device mounted on FR4 PCB, single-sided copper, tin-plated, standard footprint 3
Thermal resistance from junction to solder point Rth(j-sp) 360 K/W 3
Forward voltage VF 715 mV IF = 1 mA; Tj = 25 °C 3
Forward voltage VF 855 mV IF = 10 mA; Tj = 25 °C 3
Forward voltage VF 1 V IF = 50 mA; Tj = 25 °C 3
Forward voltage VF 1.25 V IF = 150 mA; Tj = 25 °C 3
Reverse current IR 30 nA VR = 25 V; Tj = 25 °C 3
Reverse current IR 1 µA VR = 70 V; Tj = 25 °C 3
Reverse current IR 30 µA VR = 25 V; Tj = 150 °C 3
Reverse current IR 50 µA VR = 70 V; Tj = 150 °C 3
Diode capacitance Cd 1.5 pF VR = 0 V; f = 1 MHz; Tj = 25 °C 3
Reverse recovery time trr 4 ns IF = 10 mA; IR = 10 mA; RL = 100 Ω; IR(meas) = 1 mA; Tj = 25 °C 3
Peak forward recovery voltage VFRM 1.75 V IF = 10 mA; tr = 20 ns; Tj = 25 °C 3

CAD (KiCad official)

  • Symbol: BAL99
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: bal99-etched.step / bal99-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bal99.step / bal99.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Nexperia datasheet (9 pp, sha256 aa7bdc620b1aecc4, retrieved 2026-10-17, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF