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BA50DD0T

ROHM Semicon · Linear Voltage Regulators (LDO) · TO-220-3

BA50DD0T from ROHM Semicon, in a TO-220-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Vcc power_in Power supply voltage input; recommended 3.0V to 25.0V for BAxxDD0xx, with a capacitor greater than 0.33µF to GND.
2 GND power_in Ground terminal (N.C./GND pin is GND on TO220FP-3); keep set ground and IC ground at the same potential.
3 OUT power_out Voltage output (5.0V for BA50DD0T, up to 2A); requires an anti-oscillation capacitor between Vo and GND.

Key specifications

Parameter Value
Manufacturer ROHM Semicon
Package TO-220-3
Category Power Management
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output Voltage Vo 5 V Io=200mA, Vcc=7.0V, VCTL=3V, Ta=25C; limits printed as Votyp x 0.99 to Votyp x 1.01 6
Shut Down Current Isd 0 10 μA VCTL=0V, Io=0mA 6
Bias Current Ib 0.9 2 mA Io=0mA 6
Dropout Voltage 1 ΔVd1 0.3 0.5 V Vcc=0.95×Vo, Io=1A 6
Dropout Voltage 2 ΔVd2 0.45 0.7 V Vcc=0.95×Vo, Io=2A 6
Peak Output Current Io 2 A 6
Line Regulation Reg.I 15 50 mV Vcc=VCCT V→25V, Io=200mA 6
Load Regulation Reg.L 50 200 mV Io=0mA→2A 6
Ripple Rejection R.R. 55 dB f=120Hz, ein=-20dBV, Io=100mA 6
Temperature Coefficient of Output Voltage Tcvo 0.02 %/℃ Io=5mA, Tj=0 to 125℃ (typ printed as ±0.02; not 100% tested) 6
Input Power Supply Voltage VCC 3 25 V BAxxDD0xx, Ta=25℃ 5
Output Current Io 2 A BAxxDD0xx, Ta=25℃ 5
Input Power Supply Voltage VCC -0.3 35 V Ta=25℃; must not exceed Pd 5
Power Dissipation Pd 2000 mW TO220FP-3,5, Ta=25℃, no heat sink 5
Operating Temperature Range Topr -40 125 ℃ Ta=25℃ 5
Ambient Storage Temperature Tstg -55 150 ℃ Ta=25℃ 5
Junction Temperature TjMAX 150 ℃ Ta=25℃ 5
Voltage Applied to the Tip VCC peak 50 V Applied voltage 200msec or less (tr≥1msec) 5
Thermal Resistance Junction-Ambient (IC alone) θj-a 62.5 ℃/W IC alone, TO220FP package (printed as θj-6 on page 13; θja on page 14) 13
Thermal Resistance Junction-Case (max heat sink) θj-c 6.25 ℃/W When using a maximum heat sink 13

CAD (KiCad official)

  • Symbol: BA50DD0T
  • Footprint: Package_TO_SOT_THT:TO-220-3_Vertical
  • 3D model: TO-220-3 (KiCad packages3D, STEP)
  • 3D model files: ba50dd0t-etched.step / ba50dd0t-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ba50dd0t.step / ba50dd0t.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: ROHM Semicon datasheet (23 pp, sha256 a7cdaf4806983a19, retrieved 2026-10-31, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF