# B5819WSX

**Shenzhen JingYang** · Schottky Diodes · SOD-323

B5819WSX from Shenzhen JingYang, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Shenzhen JingYang |
| Package | SOD-323 |
| Category | Diodes |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Non-Repetitive Peak reverse voltage | VRM |  |  | 40 | V | Ta=25℃ | 1 |
| Peak repetitive reverse voltage / Working peak reverse voltage / DC reverse voltage | VRRM/VRWM/VR |  |  | 40 | V | Ta=25℃ | 1 |
| RMS Reverse Voltage | VR(RMS) |  |  | 28 | V | Ta=25℃ | 1 |
| Average Rectified output Current | Io |  |  | 1 | A | Ta=25℃ | 1 |
| Peak forward surge current | IFSM |  |  | 9 | A | 8.3ms | 1 |
| Power Dissipation | Pd |  |  | 250 | mW | Ta=25℃ | 1 |
| Thermal Resistance Junction to Ambient | RθJA |  |  | 500 | ℃/mW |  | 1 |
| Junction and Storage Temperature | TJ,TSTG | -55 |  | 125 | ℃ |  | 1 |
| Reverse breakdown voltage | V(BR) | 40 |  |  | V | IR=1mA | 2 |
| Reverse voltage leakage current | IR |  |  | 1 | mA | VR=40V | 2 |
| Forward voltage | VF |  |  | 0.6 | V | IF=1A | 2 |
| Forward voltage | VF |  |  | 0.9 | V | IF=3A | 2 |
| Diode capacitance | CD |  |  | 120 | pF | VR=4V,f=1MHz | 2 |

## CAD (KiCad official)

- Symbol: `B5819WSX`
- Footprint: `Diode_SMD:D_SOD-323`
- 3D model: SOD-323 (KiCad packages3D, STEP)
- 3D model files: `b5819wsx-etched.step` / `b5819wsx-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `b5819wsx.step` / `b5819wsx.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Shenzhen JingYang datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8603348822995726336) (3 pp, sha256 `0755a3bd976842af`, retrieved 2026-10-22, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `cathode-band convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/b5819wsx-datasheet.pdf)