# B5819WSL-TP

**MCC(Micro Commercial Components)** · Diodes - General Purpose · SOD-323FL

B5819WSL-TP from MCC(Micro Commercial Components), in a SOD-323FL. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | MCC(Micro Commercial Components) |
| Package | SOD-323FL |
| Category | Diodes |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum Forward Voltage | VF |  | 0.52 | 0.6 | V | IFM=1.0A; TJ=25°C (Note 2) | 1 |
| Maximum Forward Voltage | VF |  |  | 0.9 | V | IFM=3.0A; TJ=25°C (Note 2) | 1 |
| Maximum DC Reverse Current | IR |  |  | 50 | µA | At rated DC blocking voltage, TJ=25°C | 1 |
| Typical Junction Capacitance | CJ |  | 120 |  | pF | Measured at 1.0MHz, VR=4.0V | 1 |
| Maximum Recurrent Peak Reverse Voltage | VRRM |  |  | 40 | V |  | 1 |
| Maximum RMS Voltage | VRMS |  |  | 28 | V |  | 1 |
| Maximum DC Blocking Voltage | VDC |  |  | 40 | V |  | 1 |
| Average Forward Current | IF(AV) |  |  | 1 | A |  | 1 |
| Peak Forward Surge Current | IFSM |  |  | 10 | A | t=8.3ms Half Sine | 1 |
| Repetitive Peak Forward Current | IFRM |  |  | 7 | A | tp≤1ms; Duty Cycle≤25% | 1 |
| Power Dissipation | PD |  |  | 250 | mW |  | 1 |
| Operating Junction Temperature Range | TJ | -65 |  | 125 | °C |  | 1 |
| Storage Temperature Range | Tstg | -65 |  | 150 | °C |  | 1 |
| Maximum Thermal Resistance Junction to Ambient | RθJA |  |  | 500 | °C/W | Junction to Ambient | 1 |

## CAD (KiCad official)

- Symbol: `B5819WSL-TP`
- Footprint: `Diode_SMD:D_SOD-323F`
- 3D model: SOD-323FL (KiCad packages3D, STEP)
- 3D model files: `b5819wsl-tp-etched.step` / `b5819wsl-tp-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `b5819wsl-tp.step` / `b5819wsl-tp.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [MCC(Micro Commercial Components) datasheet](docs/b5819wsl-tp-datasheet.pdf) (3 pp, sha256 `22e10ba1fefb16c5`, retrieved 2026-10-22, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `cathode-band convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/b5819wsl-tp-datasheet.pdf)