# B5819WSFL

**Shandong Jingdao Microelectronics** · Schottky Barrier Diodes (SBD) · SOD-323FL

B5819WSFL from Shandong Jingdao Microelectronics, in a SOD-323FL. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Cathode | passive | Cathode terminal of the Schottky barrier rectifier, rated up to 40 V repetitive peak reverse voltage and 1 A average forward current for the B5819WSFL. |
| 2 | Anode | passive | Anode terminal of the Schottky barrier rectifier, which forms the forward conduction path opposite the cathode. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Shandong Jingdao Microelectronics |
| Package | SOD-323FL |
| Category | Diodes |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum Repetitive Peak Reverse Voltage | VRRM |  |  | 40 | V |  | 1 |
| Maximum RMS voltage | VRMS |  |  | 28 | V |  | 1 |
| Maximum Average Forward Rectified Current | IF(AV) |  |  | 1 | A |  | 1 |
| Peak Forward Surge Current, 8.3ms Single Half Sine-wave Superimposed On Rated Load (JEDEC method) | IFSM |  |  | 25 | A | 8.3 ms single half sine-wave, JEDEC method | 1 |
| Maximum Instantaneous Forward Voltage | VF |  |  | 0.6 | V | at 1 A | 1 |
| Maximum Instantaneous Forward Voltage | VF |  |  | 0.9 | V | at 3 A | 1 |
| Maximum Instantaneous Reverse Current at Rated DC Reverse Voltage | IR |  |  | 1 | mA | TA = 25°C, rated DC reverse voltage | 1 |
| Maximum Instantaneous Reverse Current at Rated DC Reverse Voltage | IR |  |  | 10 | mA | TA = 100°C, rated DC reverse voltage | 1 |
| Junction temperature | Tj | -55 |  | 125 | °C |  | 1 |
| Storage temperature | Tstg | -55 |  | 150 | °C |  | 1 |

## CAD (KiCad official)

- Symbol: `B5819WSFL`
- Footprint: `Diode_SMD:D_SOD-323F`
- 3D model: SOD-323FL (KiCad packages3D, STEP)
- 3D model files: `b5819wsfl-etched.step` / `b5819wsfl-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `b5819wsfl.step` / `b5819wsfl.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Shandong Jingdao Microelectronics datasheet](docs/b5819wsfl-datasheet.pdf) (3 pp, sha256 `c24adf386565a09a`, retrieved 2026-10-30, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/b5819wsfl-datasheet.pdf)