component
B5819WS
Public Made by Adomby adom
FUXINSEMI Schottky Barrier Diodes (SBD), SOD-323(SC-90). Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
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B5819WS
FUXINSEMI · Schottky Barrier Diodes (SBD) · SOD-323(SC-90)
B5819WS from FUXINSEMI, in a SOD-323(SC-90). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | FUXINSEMI |
| Package | SOD-323(SC-90) |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Peak repetitive reverse voltage | VRRM | 40 | V | 1 | |||
| RMS reverse voltage | VR(RMS) | 28 | V | 1 | |||
| Average rectified output current | IO | 1 | A | 1 | |||
| Peak forward surge current | IFSM | 30 | A | @=8.3ms | 1 | ||
| Power dissipation | Pd | 250 | mW | 1 | |||
| Thermal resistance junction to ambient | RΘJA | 500 | K/W | 1 | |||
| Operating junction temperature range | TJ | -55 | 150 | C | 1 | ||
| Storage temperature | TSTG | -55 | 150 | C | 1 | ||
| Forward voltage | VF | 0.6 | V | IF=1A | 1 | ||
| Forward voltage | VF | 0.9 | V | IF=3A | 1 |
CAD (KiCad official)
- Symbol:
B5819WS - Footprint:
Diode_SMD:D_SOD-323 - 3D model: SOD-323(SC-90) (KiCad packages3D, STEP)
- 3D model files:
b5819ws-etched.step/b5819ws-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);b5819ws.step/b5819ws.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: FUXINSEMI datasheet (2 pp, sha256
feec2b631f4ede4b, retrieved 2026-10-21, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarycathode-band convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# B5819WS
**FUXINSEMI** · Schottky Barrier Diodes (SBD) · SOD-323(SC-90)
B5819WS from FUXINSEMI, in a SOD-323(SC-90). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | FUXINSEMI |
| Package | SOD-323(SC-90) |
| Category | Diodes |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Peak repetitive reverse voltage | VRRM | | | 40 | V | | 1 |
| RMS reverse voltage | VR(RMS) | | | 28 | V | | 1 |
| Average rectified output current | IO | | | 1 | A | | 1 |
| Peak forward surge current | IFSM | | | 30 | A | @=8.3ms | 1 |
| Power dissipation | Pd | | | 250 | mW | | 1 |
| Thermal resistance junction to ambient | RΘJA | | | 500 | K/W | | 1 |
| Operating junction temperature range | TJ | -55 | | 150 | C | | 1 |
| Storage temperature | TSTG | -55 | | 150 | C | | 1 |
| Forward voltage | VF | | | 0.6 | V | IF=1A | 1 |
| Forward voltage | VF | | | 0.9 | V | IF=3A | 1 |
## CAD (KiCad official)
- Symbol: `B5819WS`
- Footprint: `Diode_SMD:D_SOD-323`
- 3D model: SOD-323(SC-90) (KiCad packages3D, STEP)
- 3D model files: `b5819ws-etched.step` / `b5819ws-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `b5819ws.step` / `b5819ws.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [FUXINSEMI datasheet](docs/b5819ws-datasheet.pdf) (2 pp, sha256 `feec2b631f4ede4b`, retrieved 2026-10-21, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `cathode-band convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/b5819ws-datasheet.pdf)