# B5818WS

**Shandong Jingdao Microelectronics** · Schottky Diodes · SOD-323

B5818WS from Shandong Jingdao Microelectronics, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Cathode | passive | Cathode of the Schottky rectifier; B5818WS is rated 30 V VRRM, 21 V VRMS and 30 V DC blocking voltage with 1 A average forward current. |
| 2 | Anode | passive | Anode of the Schottky rectifier; B5818WS is rated 30 V VRRM, 21 V VRMS and 30 V DC blocking voltage with 1 A average forward current. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Shandong Jingdao Microelectronics |
| Package | SOD-323 |
| Category | Diodes |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum Repetitive Peak Reverse Voltage | VRRM |  |  | 30 | V | B5818WS column | 1 |
| Maximum RMS Voltage | VRMS |  |  | 21 | V | B5818WS column | 1 |
| Maximum DC Blocking Voltage | VDC |  |  | 30 | V | B5818WS column | 1 |
| Maximum Average Forward Rectified Current | IF(AV) |  |  | 1 | A |  | 1 |
| Peak Forward Surge Current | IFSM |  |  | 9 | A | 8.3ms single half sine-wave superimposed on rated load (JEDEC method) | 1 |
| Maximum Instantaneous Reverse Current | IR |  |  | 1 | mA | Rated DC reverse voltage, TA = 25°C | 1 |
| Maximum Instantaneous Reverse Current | IR |  |  | 10 | mA | Rated DC reverse voltage, TA = 100°C | 1 |
| Storage and Operating Junction Temperature Range | Tj, Tstg | -55 |  | 150 | °C |  | 1 |
| Typical Junction Capacitance | Cj |  | 110 |  | pF |  | 1 |

## CAD (KiCad official)

- Symbol: `B5818WS`
- Footprint: `Diode_SMD:D_SOD-323`
- 3D model: SOD-323 (KiCad packages3D, STEP)
- 3D model files: `b5818ws-etched.step` / `b5818ws-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `b5818ws.step` / `b5818ws.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Shandong Jingdao Microelectronics datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588905357670694912) (3 pp, sha256 `12b248fab7bb5b98`, retrieved 2026-10-22, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/b5818ws-datasheet.pdf)