# B5817WS-TP

**MCC Micro Commercial Components** · Schottky Diodes · SOD-323

B5817WS-TP from MCC Micro Commercial Components, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | MCC Micro Commercial Components |
| Package | SOD-323 |
| Category | Diodes |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum Recurrent Peak Reverse Voltage | VRRM |  |  | 20 | V | B5817WS | 1 |
| Maximum RMS Voltage | VRMS |  |  | 14 | V | B5817WS | 1 |
| Maximum DC Blocking Voltage | VDC |  |  | 20 | V | B5817WS | 1 |
| Average Forward Current | IF(AV) |  |  | 1 | A | Tc = 90 | 1 |
| Peak Forward Surge Current | IFSM |  |  | 10 | A | 8.3ms, half sine | 1 |
| Maximum Instantaneous Forward Voltage | VF |  |  | 0.45 | V | IFM = 1.0A; TJ = 25 (Note 1) | 1 |
| Maximum Instantaneous Forward Voltage | VF |  |  | 0.75 | V | IFM = 3A; TJ = 25 (Note 1) | 1 |
| Maximum DC Reverse Current At Rated DC Blocking Voltage | IR |  |  | 1 | mA | TA = 25 | 1 |
| Typical Junction Capacitance | CJ |  | 120 |  | pF | Measured at 1.0MHz, VR=4.0V | 1 |
| Operating Temperature |  | -65 |  | 125 | °C |  | 1 |
| Storage Temperature |  | -65 |  | 150 | °C |  | 1 |
| Maximum Thermal Resistance Junction To Ambient |  |  |  | 500 | °C/W | Junction To Ambient | 1 |

## CAD (KiCad official)

- Symbol: `B5817WS-TP`
- Footprint: `Diode_SMD:D_SOD-323`
- 3D model: SOD-323 (KiCad packages3D, STEP)
- 3D model files: `b5817ws-tp-etched.step` / `b5817ws-tp-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `b5817ws-tp.step` / `b5817ws-tp.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [MCC Micro Commercial Components datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588906703600930816) (3 pp, sha256 `ed3c3f593c061b86`, retrieved 2026-10-22, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `cathode-band convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/b5817ws-tp-datasheet.pdf)