# B5817W-SJ

**JUXING** · Schottky Diodes · SOD-123

B5817W-SJ from JUXING, in a SOD-123. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode, the end marked with the color band; the datasheet specifies reverse voltage of 20 V for B5817W (VRRM 20 V, VR 20 V at IR 1 mA). |
| 2 | A | passive | Anode, the end opposite the color band; average forward rectified current 1.0 A, forward voltage 0.450 V max at IF = 1.0 A for B5817W. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | JUXING |
| Package | SOD-123 |
| Category | Diodes |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum repetitive peak reverse voltage | VRRM |  |  | 20 | V |  | 1 |
| Maximum RMS voltage | VRMS |  |  | 14 | V |  | 1 |
| Maximum DC blocking voltage | VDC |  |  | 20 | V |  | 1 |
| Maximum average forward rectified current | IFM |  |  | 1 | A |  | 1 |
| Peak forward surge current | IFSM |  |  | 9 | A | 8.3 ms single half sine-wave | 1 |
| Power Dissipation | PD |  |  | 500 | mW |  | 1 |
| Storage temperature range | TSTG | -50 |  | 150 | ℃ |  | 1 |
| Maximum forward voltage | VF |  |  | 0.45 | V | IF = 1.0A | 1 |
| Maximum forward voltage | VF |  |  | 0.75 | V | IF = 3.0A | 1 |
| Maximum reverse breakdown voltage | VR | 20 |  |  | V | IR=1mA | 1 |
| Maximum reverse current (B5817W, VR=20V) | IR |  |  | 1 | mA | VR=20V B5817W | 1 |
| Typical thermal resistance | RθJA |  | 250 |  | ℃/W |  | 1 |
| Type junction capacitance | Cj |  | 120 |  | pF | VR = 4.0V, f = 1MHz | 1 |

## CAD (KiCad official)

- Symbol: `B5817W-SJ`
- Footprint: `Diode_SMD:D_SOD-123F`
- 3D model: SOD-123 (KiCad packages3D, STEP)
- 3D model files: `b5817w-sj-etched.step` / `b5817w-sj-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `b5817w-sj.step` / `b5817w-sj.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [JUXING datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8603086277080469504) (2 pp, sha256 `80bc6b2a32d8dac7`, retrieved 2026-10-18, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/b5817w-sj-datasheet.pdf)