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Contents

README

markdown

B560CX-13

Diodes Incorporated · Schottky Diodes · SMC

B560CX-13 from Diodes Incorporated, in a SMC. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SMC
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak Repetitive Reverse Voltage / Working Peak Reverse Voltage / DC Blocking Voltage VRRM 60 V 2
Average Rectified Output Current IO 5 A Single phase, half wave, 60Hz, resistive or inductive load; derate 20% for capacitive load 2
Non-Repetitive Peak Forward Surge Current IFSM 95 A 1ms single half sine wave superimposed on rated load 2
Thermal Resistance Junction to Ambient RθJA 50 °C/W Note 6: FR-4 substrate, 0.4" x 0.5", 2oz, single-sided, 0.2" x 0.25" copper pad 2
Operating and Storage Temperature Range TJ, TSTG -55 150 °C Note 6 (same mounting as RθJA) 2
Forward Voltage Drop VF 0.5 0.6 V IF = 5.0A, TJ = +25°C 2
Forward Voltage Drop VF 0.43 V IF = 5.0A, TJ = +125°C 2
Leakage Current IR 30 300 µA VR = 60V, TJ = +25°C (Note 7: short duration pulse test) 2
Leakage Current IR 20 mA VR = 60V, TJ = +100°C (Note 7: short duration pulse test) 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin  Terminals: Lead Free Plating (Matte Tin Finish). Solderable per MIL-STD-202, Method 208 1

CAD (KiCad official)

  • Symbol: B560CX-13
  • Footprint: Diode_SMD:D_SMC
  • 3D model: SMC (KiCad packages3D, STEP)
  • 3D model files: b560cx-13-etched.step / b560cx-13-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); b560cx-13.step / b560cx-13.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (5 pp, sha256 e943db6a8ad70ada, retrieved 2026-10-16, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF