component

B550C-13-F

Public Made by Adom

by adom

Diodes Incorporated Schottky Barrier Diodes (SBD), SMC(DO-214AB). Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.

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B550C-13-F

Diodes Incorporated · Schottky Barrier Diodes (SBD) · SMC(DO-214AB)

B550C-13-F from Diodes Incorporated, in a SMC(DO-214AB). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SMC(DO-214AB)
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak Repetitive Reverse Voltage VRRM 50 V 2
Working Peak Reverse Voltage VRWM 50 V 2
DC Blocking Voltage VR 50 V 2
RMS Reverse Voltage VR(RMS) 35 V 2
Average Rectified Output Current IO 5 A 2
Non-Repetitive Peak Forward Surge Current IFSM 100 A 8.3ms single half sine wave superimposed on rated load 2
Forward Voltage Drop (B550C, B560C) VF 0.575 0.7 V IF = 5.0A, TA = +25°C 2
Leakage Current IR 0.5 mA @ Rated VR, TA = +25°C 2
Leakage Current IR 20 mA @ Rated VR, TA = +100°C 2
Total Capacitance CT 300 pF VR = 4V, f = 1MHz 2
Operating Temperature Range TJ -55 150 °C 2
Storage Temperature Range TSTG -55 150 °C 2
Thermal Resistance, Junction to Terminal RθJT 10 °C/W 2
Thermal Resistance, Junction to Ambient RθJA 50 °C/W Note 5: junction to ambient, unit mounted on PC board with 8.0 mm2 copper pads as heatsink 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin  Terminals: Lead Free Plating (Matte Tin Finish). Solderable per MIL-STD-202, Method 208 1

CAD (KiCad official)

  • Symbol: B550C-13-F
  • Footprint: Diode_SMD:D_SMC
  • 3D model: SMC(DO-214AB) (KiCad packages3D, STEP)
  • 3D model files: b550c-13-f-etched.step / b550c-13-f-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); b550c-13-f.step / b550c-13-f.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (5 pp, sha256 1b1de94df0a7729f, retrieved 2026-10-21, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF