component
B360B-E3
Public Made by Adomby adom
Vishay Intertech Schottky Barrier Diodes (SBD), SMB(DO-214AA). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownB360B-E3
Vishay Intertech · Schottky Barrier Diodes (SBD) · SMB(DO-214AA)
B360B-E3 from Vishay Intertech, in a SMB(DO-214AA). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode, the terminal at the end marked by the color band on the DO-214AA (SMB) package. |
| 2 | A | passive | Anode terminal of the single-die Schottky rectifier, at the end opposite the cathode band. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Vishay Intertech |
| Package | SMB(DO-214AA) |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum repetitive peak reverse voltage | VRRM | 60 | V | TA = 25 °C | 1 | ||
| Maximum average forward rectified current | IF(AV) | 3 | A | at TL (fig. 1) | 1 | ||
| Peak forward surge current | IFSM | 60 | A | 8.3 ms single half sine-wave superimposed on rated load | 1 | ||
| Operating junction and storage temperature range | TJ, TSTG | -55 | 150 | °C | 1 | ||
| Maximum instantaneous forward voltage | VF | 0.58 | 0.66 | V | IF = 3.0 A, TJ = 25 °C, pulse 300 μs, 1 % duty cycle | 1 | |
| Maximum instantaneous forward voltage | VF | 0.51 | 0.59 | V | IF = 3.0 A, TJ = 125 °C, pulse 300 μs, 1 % duty cycle | 1 | |
| Maximum reverse current | IR | 100 | μA | Rated VR, TJ = 25 °C | 1 | ||
| Maximum reverse current | IR | 3 | 10 | mA | Rated VR, TJ = 125 °C | 1 | |
| Typical thermal resistance junction to ambient | RθJA | 70 | °C/W | PCB mounted with 0.4" x 0.4" (10 mm x 10 mm) copper pad areas | 2 | ||
| Typical thermal resistance junction to mount | RθJM | 15 | °C/W | PCB mounted with 0.4" x 0.4" (10 mm x 10 mm) copper pad areas | 2 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | Terminals: Matte tin plated leads, solderable per J-STD-002 and JESD 22-B102 | 1 |
CAD (KiCad official)
- Symbol:
B360B-E3 - Footprint:
Diode_SMD:D_SMB - 3D model: SMB(DO-214AA) (KiCad packages3D, STEP)
- 3D model files:
b360b-e3-etched.step/b360b-e3-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);b360b-e3.step/b360b-e3.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Vishay Intertech datasheet (4 pp, sha256
ae4c7be6fca4e193, retrieved 2026-10-22, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).