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B350AQ-13-F

Diodes Incorporated · Schottky Diodes · DO-214AC

B350AQ-13-F from Diodes Incorporated, in a DO-214AC. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package DO-214AC
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Forward Voltage Drop VF 0.7 V IF = 3.0A, TA = +25°C 2
Leakage Current IR 0.5 mA @ Rated VR, TA = +25°C 2
Leakage Current IR 20 mA @ Rated VR, TA = +100°C 2
Peak Repetitive Reverse Voltage VRRM 50 V 2
Working Peak Reverse Voltage VRWM 50 V 2
DC Blocking Voltage VR 50 V 2
Average Rectified Output Current IO 3 A 2
Non-Repetitive Peak Forward Surge Current IFSM 80 A 8.3ms Single Half Sine-Wave Superimposed on Rated Load 2
Maximum Total Power Dissipation PD 850 mW Steady State, TA = +25°C (Note 6) 2
Operating Temperature Range TJ -55 150 °C 2
Storage Temperature Range TSTG -55 150 °C 2
Typical Thermal Resistance, Junction to Ambient RθJA 140 °C/W Note 6: device mounted on FR-4 PCB, with minimum recommended pad layout 2
Typical Thermal Resistance, Junction to Terminal RθJT 25 °C/W Note 7: device mounted on glass epoxy substrate with 2mm x 3mm copper pad 2
Typical Thermal Resistance, Junction to Ambient RθJA 100 °C/W Note 7: device mounted on glass epoxy substrate with 2mm x 3mm copper pad 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin  Terminals: Lead Free Plating (Matte-Tin Finish). Solderable per MIL-STD-202, Method 208 1

CAD (KiCad official)

  • Symbol: B350AQ-13-F
  • Footprint: Diode_SMD:D_SMA
  • 3D model: DO-214AC (KiCad packages3D, STEP)
  • 3D model files: b350aq-13-f-etched.step / b350aq-13-f-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); b350aq-13-f.step / b350aq-13-f.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (6 pp, sha256 4c8e855269f492b5, retrieved 2026-10-22, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF