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Ray Publish 0.1.0 158a174 7d ago

B330B-13-F

Diodes Incorporated · Schottky Barrier Diodes (SBD) · SMB(DO-214AA)

B330B-13-F from Diodes Incorporated, in a SMB(DO-214AA). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SMB(DO-214AA)
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Forward Voltage Drop (B320B, B330B, B340B, B340BQ) VF 0.5 V IF = 3.0A, TA = +25°C 2
Leakage Current @ Rated VR IR 0.5 mA @ Rated VR, TA = +25°C 2
Leakage Current @ Rated VR IR 20 mA @ Rated VR, TA = +100°C 2
Total Capacitance CT 200 pF VR = 4V, f = 1MHz 2
Peak Repetitive Reverse Voltage VRRM 30 V B330B column of Maximum Ratings table 2
Working Peak Reverse Voltage VRWM 30 V B330B column of Maximum Ratings table 2
DC Blocking Voltage VR 30 V B330B column of Maximum Ratings table 2
Average Rectified Output Current IO 3 A @ TT = +100°C 2
Non-Repetitive Peak Forward Surge Current IFSM 100 A 8.3ms single half sine-wave superimposed on rated load 2
Typical Thermal Resistance, Junction to Terminal RθJT 25 °C/W Junction to terminal, unit mounted on glass epoxy substrate with 2x3mm copper pad (Note 6) 2
Typical Thermal Resistance, Junction to Ambient RθJA 95 °C/W Note 6 2
Operating Temperature Range TJ -55 150 °C 2
Storage Temperature Range TSTG -55 150 °C 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin  Terminals: Lead Free Plating (Matte Tin Finish). Solderable per MIL-STD-202, Method 208 1

CAD (KiCad official)

  • Symbol: B330B-13-F
  • Footprint: Diode_SMD:D_SMB
  • 3D model: SMB(DO-214AA) (KiCad packages3D, STEP)
  • 3D model files: b330b-13-f-etched.step / b330b-13-f-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); b330b-13-f.step / b330b-13-f.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (5 pp, sha256 4ebdb9f4ae9e46a8, retrieved 2026-10-21, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF