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Contents

README

markdown

B3100BE-13

Diodes Incorporated · Schottky Barrier Diodes (SBD) · SMB

B3100BE-13 from Diodes Incorporated, in a SMB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SMB
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak Repetitive Reverse Voltage VRRM 100 V B3100BE, TA = +25°C 2
Working Peak Reverse Voltage VRWM 100 V B3100BE, TA = +25°C 2
DC Blocking Voltage VRM 100 V B3100BE, TA = +25°C 2
Average Rectified Output Current IO 3 A TA = +25°C 2
Non-Repetitive Peak Forward Surge Current IFSM 100 A 8.3ms single half sine-wave superimposed on rated load 2
Forward Voltage Drop VF 0.79 V IF = 3A, TA = +25°C 2
Forward Voltage Drop VF 0.6 V IF = 3A, TA = +125°C 2
Leakage Current IR 0.3 mA VR = 100V, TA = +25°C 2
Leakage Current IR 0.7 mA VR = 100V, TA = +125°C 2
Typical Capacitance CT 105 pF VR = 4.0V, f = 1MHz 2
Thermal Resistance Junction to Ambient (SMB) RθJA 90 °C/W FR-4, 1"*1", 2oz, 0.56"*0.73" copper pad 2
Thermal Resistance Junction to Case (SMB) RθJC 50 °C/W FR-4, 1"*1", 2oz, 0.56"*0.73" copper pad 2
Operating and Storage Temperature Range TJ, TSTG -55 150 °C 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts Copper tin  Terminals: Finish - Matte Tin Annealed over Copper Leadframe. 1

CAD (KiCad official)

  • Symbol: B3100BE-13
  • Footprint: Diode_SMD:D_SMB
  • 3D model: SMB (KiCad packages3D, STEP)
  • 3D model files: b3100be-13-etched.step / b3100be-13-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); b3100be-13.step / b3100be-13.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (6 pp, sha256 0e62c0c8c9d8c939, retrieved 2026-10-22, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF