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B280

GME(银河微电) · Schottky Diodes · SMB

B280 from GME(银河微电), in a SMB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer GME(银河微电)
Package SMB
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Instantaneous Forward Voltage VF 0.8 V IF = 2.0A @ TA = 25°C; pulse test 300us, 1% duty cycle 2
Maximum Reverse Current @ TJ = 25°C IR 30 μA Rated VR, @ TJ = 25°C; pulse width 40ms 2
Maximum Reverse Current @ TJ = 100°C IR 5 mA Rated VR, @ TJ = 100°C; pulse width 40ms 2
Peak Repetitive Reverse Voltage VRRM 80 V @ TA = 25°C 1
RMS Reverse Voltage VRMS 56 V @ TA = 25°C 1
DC Blocking Voltage VDC 80 V @ TA = 25°C 1
Maximum Average Forward Output Current IF_AV 2 A @ TA = 25°C 1
Peak Forward Surge Current IFSM 50 A 8.3ms Single Half Sine wave; @ TA = 25°C 1
Typical Thermal Resistance, junction to ambient RΘJA 60 °C/W Device mounted on p.c.b. with 10 mm x 20 mm x 0.1 mm copper pad area 1
Typical Thermal Resistance, junction to case RΘJC 23 °C/W Device mounted on p.c.b. with 10 mm x 20 mm x 0.1 mm copper pad area 1
Typical Thermal Resistance, junction to lead RΘJL 25 °C/W Device mounted on p.c.b. with 10 mm x 20 mm x 0.1 mm copper pad area 1
Operating Junction Temperature Range TJ -55 150 °C 1
Storage Temperature Range TSTG -55 150 °C 1

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin  Terminals: Matte tin plated leads; solderable per J-STD-002 and JESD22-B102  Polarity: Color band denotes cathode end 1

CAD (KiCad official)

  • Symbol: B280
  • Footprint: Diode_SMD:D_SMB
  • 3D model: SMB (KiCad packages3D, STEP)
  • 3D model files: b280-etched.step / b280-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); b280.step / b280.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: GME(银河微电) datasheet (4 pp, sha256 38304296147a2b29, retrieved 2026-11-08, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF