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Made with KiCad 10.0 · needs KiCad 10.0 or later to open · KiCad file format 20260206
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B260BE-13

Diodes Incorporated · Schottky Diodes · SMB

B260BE-13 from Diodes Incorporated, in a SMB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SMB
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Forward Voltage Drop, IF = 2A, TJ = +25°C VF 0.55 0.65 V IF = 2A, TJ = +25°C 2
Leakage Current, VR = 60V, TJ = +25°C IR 0.02 0.2 mA VR = 60V, TJ = +25°C (B260AE/B260BE); short duration pulse test (Note 6) 2
Typical Capacitance CT 75 pF VR = 4.0V, f = 1MHz 2
Peak Repetitive Reverse Voltage / Working Peak Reverse Voltage / DC Blocking Voltage (B260BE) VRRM, VRWM, VRM 60 V @TA = +25°C, unless otherwise specified 2
Average Rectified Output Current IO 2 A Single phase, half wave, 60Hz, resistive or inductive load; for capacitive load derate current by 20% 2
Non-Repetitive Peak Forward Surge Current 8.3ms Single Half Sine-Wave IFSM 50 A 8.3ms single half sine-wave superimposed on rated load 2
Operating and Storage Temperature Range TJ, TSTG -55 150 °C 2
Typical Thermal Resistance Junction to Ambient (SMB) RθJA 90 °C/W Note 5 (device mounted on FR-4 substrate, 0.4in x 0.5in, 2oz, 0.2in x 0.25in copper pad) 2
Typical Thermal Resistance Junction to Case (SMB) RθJC 40 °C/W Note 5 (device mounted on FR-4 substrate, 0.4in x 0.5in, 2oz, 0.2in x 0.25in copper pad) 2
Forward Voltage Drop, IF = 2A, TJ = +125°C VF 0.52 V IF = 2A, TJ = +125°C 2
Leakage Current, VR = 60V, TJ = +125°C IR 14.5 mA VR = 60V, TJ = +125°C (B260AE/B260BE) 2

CAD (KiCad official)

  • Symbol: B260BE-13
  • Footprint: Diode_SMD:D_SMB
  • 3D model: SMB (KiCad packages3D, STEP)
  • 3D model files: b260be-13-etched.step / b260be-13-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); b260be-13.step / b260be-13.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (6 pp, sha256 148b16f1408649aa, retrieved 2026-10-14, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF