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Contents

README

markdown

B260AE-13

Diodes Incorporated · Schottky Barrier Diodes (SBD) · SMA

B260AE-13 from Diodes Incorporated, in a SMA. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SMA
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak Repetitive Reverse Voltage VRRM 60 V TA = +25°C 2
Working Peak Reverse Voltage VRWM 60 V TA = +25°C 2
DC Blocking Voltage VRM 60 V TA = +25°C 2
Average Rectified Output Current IO 2 A TA = +25°C, single phase, half wave, 60Hz, resistive or inductive load 2
Non-Repetitive Peak Forward Surge Current IFSM 50 A 8.3ms single half sine-wave superimposed on rated load 2
Operating and Storage Temperature Range TJ, TSTG -55 150 °C 2
Forward Voltage Drop VF 0.55 0.65 V IF = 2A, TJ = +25°C 2
Forward Voltage Drop VF 0.52 V IF = 2A, TJ = +125°C 2
Leakage Current IR 0.02 0.2 mA VR = 60V, TJ = +25°C 2
Leakage Current IR 14.5 mA VR = 60V, TJ = +125°C 2
Typical Capacitance CT 75 pF VR = 4.0V, f = 1MHz 2
Typical Thermal Resistance Junction to Ambient (SMA) RθJA 95 °C/W Device mounted on FR-4 substrate, 0.4" x 0.5", 2oz, single-sided, 0.2" x 0.25" copper pad 2
Typical Thermal Resistance Junction to Case (SMA) RθJC 45 °C/W Device mounted on FR-4 substrate, 0.4" x 0.5", 2oz, single-sided, 0.2" x 0.25" copper pad 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts Copper tin  Terminals: Finish - Matte Tin Annealed over Copper Leadframe. 1

CAD (KiCad official)

  • Symbol: B260AE-13
  • Footprint: Diode_SMD:D_SMA
  • 3D model: SMA (KiCad packages3D, STEP)
  • 3D model files: b260ae-13-etched.step / b260ae-13-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); b260ae-13.step / b260ae-13.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (6 pp, sha256 148b16f1408649aa, retrieved 2026-10-22, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF