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Ray Publish 0.1.0 bdd7735 6d ago

B160Q-13-F

Diodes Incorporated · Schottky Barrier Diodes (SBD) · SMA(DO-214AC)

B160Q-13-F from Diodes Incorporated, in a SMA(DO-214AC). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SMA(DO-214AC)
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Forward Voltage Drop (B150Q/BQ, B160Q/BQ) VF 0.7 V IF = 1.0A 2
Leakage Current @ Rated VR, TA = +25°C IR 0.5 mA @ Rated VR, TA = +25°C 2
Leakage Current @ Rated VR, TA = +100°C IR 10 mA @ Rated VR, TA = +100°C 2
Total Capacitance CT 110 pF VR = 4V, f = 1MHz 2
Peak Repetitive Reverse Voltage VRRM 60 V 2
Working Peak Reverse Voltage VRWM 60 V 2
DC Blocking Voltage VR 60 V 2
RMS Reverse Voltage VR(RMS) 42 V 2
Average Rectified Output Current IO 1 A @ TT = +130°C 2
Non-Repetitive Peak Forward Surge Current IFSM 30 A 8.3ms single half sine-wave superimposed on rated load 2
Electrostatic Discharge HBM 4000 V 2
Electrostatic Discharge MM 400 V 2
Electrostatic Discharge CDM 1 kV 2
Typical Thermal Resistance Junction to Ambient RθJA 115 °C/W Note 6: 1*MRP FR-4 PC board, 2oz. 2
Typical Thermal Resistance Junction to Ambient RθJA 65 °C/W Note 7: With 50mm50mm23mm Al heatsink. 2
Operating and Storage Temperature Range TJ, TSTG -65 150 °C 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin  Terminals: Lead Free Plating (Matte Tin Finish). Solderable per MIL-STD-202, Method 208 1

CAD (KiCad official)

  • Symbol: B160Q-13-F
  • Footprint: Diode_SMD:D_SMA
  • 3D model: SMA(DO-214AC) (KiCad packages3D, STEP)
  • 3D model files: b160q-13-f-etched.step / b160q-13-f-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); b160q-13-f.step / b160q-13-f.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (7 pp, sha256 6ad7e983128c635c, retrieved 2026-10-21, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF