component

B0540WQ-7-F

Public Made by Adom

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Diodes Incorporated Schottky Barrier Diodes (SBD), SOD-123. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.

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3D Model

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Symbol & Footprint

Schematic Symbol

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PCB Footprint

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Datasheet

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Contents

README

markdown

B0540WQ-7-F

Diodes Incorporated · Schottky Barrier Diodes (SBD) · SOD-123

B0540WQ-7-F from Diodes Incorporated, in a SOD-123. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOD-123
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Minimum Reverse Breakdown Voltage V(BR)R 40 V IR = 20µA, TA = +25°C 2
Maximum Forward Voltage Drop VFM 0.51 V IF = 0.5A, TJ = +25°C 2
Maximum Forward Voltage Drop VFM 0.62 V IF = 1.0A, TJ = +25°C 2
Maximum Forward Voltage Drop VFM 0.46 V IF = 0.5A, TJ = +100°C 2
Maximum Forward Voltage Drop VFM 0.61 V IF = 1.0A, TJ = +100°C 2
Maximum Leakage Current IRM 10 µA VR = 20V, TJ = +25°C 2
Maximum Leakage Current IRM 20 µA VR = 40V, TJ = +25°C 2
Maximum Leakage Current IRM 5 mA VR = 20V, TJ = +100°C 2
Maximum Leakage Current IRM 13 mA VR = 40V, TJ = +100°C 2
Total Capacitance CT 170 pF f = 1MHz, VR = 0V 2
Peak Repetitive Reverse Voltage / Working Peak Reverse Voltage / DC Blocking Voltage VRRM/VRWM/VR 40 V TA = +25°C 2
RMS Reverse Voltage VR(RMS) 28 V TA = +25°C 2
Average Rectified Output Current IO 0.5 A TA = +25°C 2
Non-Repetitive Peak Forward Surge Current IFSM 5.5 A 8.3ms single half sine-wave superimposed on rated load 2
Operating and Storage Temperature Range TJ, TSTG -65 150 °C 2
Thermal Resistance Junction to Ambient Air (FR-4 PCB, Note 6) RθJA 385 °C/W TA = +25°C, minimum recommended pad layout 2
Thermal Resistance Junction to Ambient Air (Polymide PCB, Note 7) RθJA 325 °C/W TA = +25°C, minimum recommended pad layout 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin  Terminals: Matte Tin Finish Annealed over Alloy 42 Leadframe. (Lead-Free Plating). Solderable per MIL-STD-202, Method 208 1

CAD (KiCad official)

  • Symbol: B0540WQ-7-F
  • Footprint: Diode_SMD:D_SOD-123F
  • 3D model: SOD-123 (KiCad packages3D, STEP)
  • 3D model files: b0540wq-7-f-etched.step / b0540wq-7-f-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); b0540wq-7-f.step / b0540wq-7-f.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (5 pp, sha256 ab0b26e9a7798905, retrieved 2026-10-22, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF