component
AZ5725-01F-MS
Public Made by Adomby adom
MSKSEMI ESD Protection Devices, DFN1006-2. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
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AZ5725-01F-MS
MSKSEMI · ESD Protection Devices · DFN1006-2
AZ5725-01F-MS from MSKSEMI, in a DFN1006-2. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised fuse; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised fuse; either orientation. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | MSKSEMI |
| Package | DFN1006-2 |
| Category | TVS/Fuse/Board Level Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| IEC 61000-4-2 ESD Contact | -30 | 30 | kV | IEC 61000-4-2 contact | 3 | ||
| Peak Power | PPK | 70 | W | 8 x 20µs waveform | 3 | ||
| Total Power Dissipation | PD | 300 | mW | FR-5 board, TA = 25°C | 3 | ||
| Junction and Storage Temperature Range | TJ, Tstg | -55 | 150 | °C | 3 | ||
| Lead Solder Temperature | TL | 260 | °C | Maximum, 10 second duration | 3 | ||
| Working Peak Reverse Voltage | VRWM | 5 | V | TA = 25°C | 3 | ||
| Reverse Leakage Current | IR1 | 0.5 | μA | @ VRWM | 3 | ||
| Reverse Leakage Current | IR2 | 0.3 | μA | @ VR=3.5V | 3 | ||
| Breakdown Voltage | VBR | 5.6 | 8 | V | @ IT = 1.0 mA, pulse test current, 25°C | 3 | |
| Clamping Voltage | VC | 9.8 | V | @ IPP = 1 A | 3 | ||
| Clamping Voltage | VC | 12.5 | V | @ MAX IPP | 3 | ||
| Maximum Reverse Peak Pulse Current | IPP | 8 | A | Surge current waveform per Figure 3 | 3 | ||
| Peak Power Dissipation | PPK | 69 | W | Surge current waveform per Figure 3 | 3 | ||
| Capacitance | C | 15 | pF | VR = 0, f = 1 MHz | 3 |
CAD (KiCad official)
- Symbol:
AZ5725-01F-MS - Footprint:
Diode_SMD:D_SOD-882 - 3D model: DFN1006-2 (KiCad packages3D, STEP)
- 3D model files:
az5725-01f-ms-etched.step/az5725-01f-ms-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);az5725-01f-ms.step/az5725-01f-ms.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: MSKSEMI datasheet (6 pp, sha256
23d1ab24db120b02, retrieved 2026-10-23, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarytwo-terminal convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# AZ5725-01F-MS
**MSKSEMI** · ESD Protection Devices · DFN1006-2
AZ5725-01F-MS from MSKSEMI, in a DFN1006-2. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised fuse; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised fuse; either orientation. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | MSKSEMI |
| Package | DFN1006-2 |
| Category | TVS/Fuse/Board Level Protection |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| IEC 61000-4-2 ESD Contact | | -30 | | 30 | kV | IEC 61000-4-2 contact | 3 |
| Peak Power | PPK | | | 70 | W | 8 x 20µs waveform | 3 |
| Total Power Dissipation | PD | | | 300 | mW | FR-5 board, TA = 25°C | 3 |
| Junction and Storage Temperature Range | TJ, Tstg | -55 | | 150 | °C | | 3 |
| Lead Solder Temperature | TL | | | 260 | °C | Maximum, 10 second duration | 3 |
| Working Peak Reverse Voltage | VRWM | | | 5 | V | TA = 25°C | 3 |
| Reverse Leakage Current | IR1 | | | 0.5 | μA | @ VRWM | 3 |
| Reverse Leakage Current | IR2 | | | 0.3 | μA | @ VR=3.5V | 3 |
| Breakdown Voltage | VBR | 5.6 | | 8 | V | @ IT = 1.0 mA, pulse test current, 25°C | 3 |
| Clamping Voltage | VC | | | 9.8 | V | @ IPP = 1 A | 3 |
| Clamping Voltage | VC | | | 12.5 | V | @ MAX IPP | 3 |
| Maximum Reverse Peak Pulse Current | IPP | | | 8 | A | Surge current waveform per Figure 3 | 3 |
| Peak Power Dissipation | PPK | | | 69 | W | Surge current waveform per Figure 3 | 3 |
| Capacitance | C | | | 15 | pF | VR = 0, f = 1 MHz | 3 |
## CAD (KiCad official)
- Symbol: `AZ5725-01F-MS`
- Footprint: `Diode_SMD:D_SOD-882`
- 3D model: DFN1006-2 (KiCad packages3D, STEP)
- 3D model files: `az5725-01f-ms-etched.step` / `az5725-01f-ms-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `az5725-01f-ms.step` / `az5725-01f-ms.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [MSKSEMI datasheet](docs/az5725-01f-ms-datasheet.pdf) (6 pp, sha256 `23d1ab24db120b02`, retrieved 2026-10-23, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `two-terminal convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/az5725-01f-ms-datasheet.pdf)