component
ATV02W330B-HF
Public Made by Adomby adom
Comchip TVS, SOD-123. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
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ATV02W330B-HF
Comchip · TVS · SOD-123
ATV02W330B-HF from Comchip, in a SOD-123. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised fuse; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised fuse; either orientation. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Comchip |
| Package | SOD-123 |
| Category | TVS/Fuse/Board Level Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Breakdown voltage | VBR | 36.7 | V | IT = 1 mA | 3 | ||
| Breakdown voltage | VBR | 40.6 | V | IT = 1 mA | 3 | ||
| Maximum clamping voltage | VC | 53.3 | V | @ IPP @ 10/1000us | 3 | ||
| Reverse leakage current | IR | 1 | uA | @ VRWM | 3 | ||
| Peak power dissipation at 10/1000us waveform | PPP | 200 | W | 10/1000us waveform (Note 1) | 1 | ||
| Peak power dissipation at 8/20us waveform | PPP | 1000 | W | 8/20us waveform (Note 1) | 1 | ||
| Power dissipation on infinite heatsink | PD | 0.4 | W | TL = 75°C | 1 | ||
| Peak forward surge current | IFSM | 20 | A | 8.3ms single half sine-wave (Note 2) | 1 | ||
| Operating junction and storage temperature range | TJ,TSTG | -55 | 150 | °C | 1 | ||
| Thermal resistance junction to ambient | RθJA | 200 | °C/W | mounted on 10x10mm copper pad areas (Note 3) | 1 | ||
| Thermal resistance junction to case | RθJC | 100 | °C/W | mounted on 10x10mm copper pad areas (Note 3) | 1 |
CAD (KiCad official)
- Symbol:
ATV02W330B-HF - Footprint:
Diode_SMD:D_SOD-123F - 3D model: SOD-123 (KiCad packages3D, STEP)
- 3D model files:
atv02w330b-hf-etched.step/atv02w330b-hf-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);atv02w330b-hf.step/atv02w330b-hf.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Comchip datasheet (5 pp, sha256
2545290f04f4cdc2, retrieved 2026-10-27, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarytwo-terminal convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# ATV02W330B-HF
**Comchip** · TVS · SOD-123
ATV02W330B-HF from Comchip, in a SOD-123. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised fuse; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised fuse; either orientation. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Comchip |
| Package | SOD-123 |
| Category | TVS/Fuse/Board Level Protection |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Breakdown voltage | VBR | 36.7 | | | V | IT = 1 mA | 3 |
| Breakdown voltage | VBR | | | 40.6 | V | IT = 1 mA | 3 |
| Maximum clamping voltage | VC | | | 53.3 | V | @ IPP @ 10/1000us | 3 |
| Reverse leakage current | IR | | | 1 | uA | @ VRWM | 3 |
| Peak power dissipation at 10/1000us waveform | PPP | | | 200 | W | 10/1000us waveform (Note 1) | 1 |
| Peak power dissipation at 8/20us waveform | PPP | | | 1000 | W | 8/20us waveform (Note 1) | 1 |
| Power dissipation on infinite heatsink | PD | | | 0.4 | W | TL = 75°C | 1 |
| Peak forward surge current | IFSM | | | 20 | A | 8.3ms single half sine-wave (Note 2) | 1 |
| Operating junction and storage temperature range | TJ,TSTG | -55 | | 150 | °C | | 1 |
| Thermal resistance junction to ambient | RθJA | | 200 | | °C/W | mounted on 10x10mm copper pad areas (Note 3) | 1 |
| Thermal resistance junction to case | RθJC | | 100 | | °C/W | mounted on 10x10mm copper pad areas (Note 3) | 1 |
## CAD (KiCad official)
- Symbol: `ATV02W330B-HF`
- Footprint: `Diode_SMD:D_SOD-123F`
- 3D model: SOD-123 (KiCad packages3D, STEP)
- 3D model files: `atv02w330b-hf-etched.step` / `atv02w330b-hf-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `atv02w330b-hf.step` / `atv02w330b-hf.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Comchip datasheet](docs/atv02w330b-hf-datasheet.pdf) (5 pp, sha256 `2545290f04f4cdc2`, retrieved 2026-10-27, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `two-terminal convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/atv02w330b-hf-datasheet.pdf)