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README

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ATSAMD51J18A-AU

Microchip Tech · Pre-ordered MCUs · TQFP-64(10x10)

ATSAMD51J18A-AU from Microchip Tech, in a TQFP-64(10x10). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model). Symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 PA00 bidirectional General-purpose I/O PA00 (EXTINT[0]); also XIN32 for XOSC32K, SERCOM1/PAD[0], TC2/WO[0].
2 PA01 bidirectional General-purpose I/O PA01 (EXTINT[1]); also XOUT32 for XOSC32K, SERCOM1/PAD[1], TC2/WO[1].
3 PA02 bidirectional General-purpose I/O PA02 (EXTINT[2]) with ADC0/AIN[0] and DAC/VOUT[0]; RTC tamper IN2.
4 PA03 bidirectional General-purpose I/O PA03 (EXTINT[3]) with ADC0/AIN[1], ANAREF/VREFA and PTC X0/Y0.
5 PB04 bidirectional General-purpose I/O PB04 (EXTINT[4]) with ADC1/AIN[6] and PTC X22/Y22.
6 PB05 bidirectional General-purpose I/O PB05 (EXTINT[5]) with ADC1/AIN[7] and PTC X23/Y23.
7 GNDANA power_in Ground for the analog supply (VDDANA).
8 VDDANA power_in Analog supply input.
9 PB06 bidirectional General-purpose I/O PB06 (EXTINT[6]) with ADC1/AIN[8], PTC X24/Y24, CCL/IN[6].
10 PB07 bidirectional General-purpose I/O PB07 (EXTINT[7]) with ADC1/AIN[9], PTC X25/Y25, CCL/IN[7].
11 PB08 bidirectional General-purpose I/O PB08 (EXTINT[8]) with ADC0/AIN[2], ADC1/AIN[0], SERCOM4/PAD[0], TC4/WO[0].
12 PB09 bidirectional General-purpose I/O PB09 (EXTINT[9]) with ADC0/AIN[3], ADC1/AIN[1], SERCOM4/PAD[1], TC4/WO[1].
13 PA04 bidirectional General-purpose I/O PA04 (EXTINT[4]) with ADC0/AIN[4], ANAREF/VREFB, AC/AIN[0], SERCOM0/PAD[0].
14 PA05 bidirectional General-purpose I/O PA05 (EXTINT[5]) with ADC0/AIN[5], AC/AIN[1], DAC/VOUT[1], SERCOM0/PAD[1].
15 PA06 bidirectional General-purpose I/O PA06 (EXTINT[6]) with ADC0/AIN[6], ANAREF/VREFC, AC/AIN[2], SERCOM0/PAD[2].
16 PA07 bidirectional General-purpose I/O PA07 (EXTINT[7]) with ADC0/AIN[7], AC/AIN[3], SERCOM0/PAD[3].
17 PA08 bidirectional General-purpose I/O PA08 (NMI), high-sink pin with I2C support, supplied by VDDIOB; ADC0/AIN[8], SERCOM0/PAD[0], QSPI/DATA[0].
18 PA09 bidirectional General-purpose I/O PA09 (EXTINT[9]), high-sink pin with I2C support, supplied by VDDIOB; ADC0/AIN[9], SERCOM0/PAD[1], QSPI/DATA[1].
19 PA10 bidirectional General-purpose I/O PA10 (EXTINT[10]) with ADC0/AIN[10], SERCOM0/PAD[2], QSPI/DATA[2], GCLK/IO[4].
20 PA11 bidirectional General-purpose I/O PA11 (EXTINT[11]) with ADC0/AIN[11], SERCOM0/PAD[3], QSPI/DATA[3], GCLK/IO[5].
21 VDDIOB power_in I/O supply for the PA08-PA11 cluster (VDDIOB).
22 GND power_in Ground.
23 PB10 bidirectional General-purpose I/O PB10 (EXTINT[10]) with SERCOM4/PAD[2], QSPI/SCK, GCLK/IO[4].
24 PB11 bidirectional General-purpose I/O PB11 (EXTINT[11]) with SERCOM4/PAD[3], QSPI/CS, GCLK/IO[5].
25 PB12 bidirectional General-purpose I/O PB12 (EXTINT[12]) with PTC X26/Y26, SERCOM4/PAD[0], CAN1/TX.
26 PB13 bidirectional General-purpose I/O PB13 (EXTINT[13]) with PTC X27/Y27, SERCOM4/PAD[1], CAN1/RX.
27 PB14 bidirectional General-purpose I/O PB14 (EXTINT[14]) with PTC X28/Y28, SERCOM4/PAD[2], GCLK/IO[0].
28 PB15 bidirectional General-purpose I/O PB15 (EXTINT[15]) with PTC X29/Y29, SERCOM4/PAD[3], GCLK/IO[1].
29 PA12 bidirectional General-purpose I/O PA12, high-sink pin with I2C support (supplied by VDDIO); multiplexed peripheral functions A-N.
30 PA13 bidirectional General-purpose I/O PA13, high-sink pin with I2C support (supplied by VDDIO); multiplexed peripheral functions A-N.
31 PA14 bidirectional General-purpose I/O PA14; also XIN for XOSC0 (VDDIO supply).
32 PA15 bidirectional General-purpose I/O PA15; also XOUT for XOSC0 (VDDIO supply).
33 GND power_in Ground.
34 VDDIO power_in Digital I/O supply.
35 PA16 bidirectional General-purpose I/O PA16, high-sink pin with I2C support; GRXDV is available on this pin in the 64-pin package.
36 PA17 bidirectional General-purpose I/O PA17, high-sink pin with I2C support (supplied by VDDIO); multiplexed peripheral functions A-N.
37 PA18 bidirectional General-purpose I/O PA18; multiplexed peripheral functions A-N.
38 PA19 bidirectional General-purpose I/O PA19; multiplexed peripheral functions A-N.
39 PB16 bidirectional General-purpose I/O PB16; multiplexed peripheral functions A-N.
40 PB17 bidirectional General-purpose I/O PB17; multiplexed peripheral functions A-N.
41 PA20 bidirectional General-purpose I/O PA20 (EXTINT[4]) with PTC X14/Y14, SERCOM5/PAD[2], TC7/WO[0].
42 PA21 bidirectional General-purpose I/O PA21 (EXTINT[5]) with PTC X15/Y15, SERCOM5/PAD[3], TC7/WO[1].
43 PA22 bidirectional General-purpose I/O PA22 (EXTINT[6]), high-sink pin with I2C support; PTC X16/Y16, SERCOM3/PAD[0], TC4/WO[0].
44 PA23 bidirectional General-purpose I/O PA23 (EXTINT[7]), high-sink pin with I2C support; PTC X17/Y17, SERCOM3/PAD[1], USB/SOF_1KHZ.
45 PA24 bidirectional General-purpose I/O PA24 (EXTINT[8]) with USB/DM, SERCOM3/PAD[2], CAN0/TX.
46 PA25 bidirectional General-purpose I/O PA25 (EXTINT[9]) with USB/DP, SERCOM3/PAD[3], CAN0/RX.
47 GND power_in Ground.
48 VDDIO power_in Digital I/O supply.
49 PB22 bidirectional General-purpose I/O PB22 (EXTINT[6]); also XIN for XOSC1, SERCOM1/PAD[2], GCLK/IO[0].
50 PB23 bidirectional General-purpose I/O PB23 (EXTINT[7]); also XOUT for XOSC1, SERCOM1/PAD[3], GCLK/IO[1].
51 PA27 bidirectional General-purpose I/O PA27 (EXTINT[11]) with PTC X18/Y18 and GCLK/IO[1].
52 RESETN input Active-low external reset input.
53 VDDCORE power_in Regulated core supply input/output (decoupling pin).
54 GND power_in Ground.
55 VSW power_out Switching output of the embedded buck regulator.
56 VDDIO power_in Digital I/O supply.
57 PA30 bidirectional General-purpose I/O PA30 (EXTINT[14]); SWCLK serial wire debug clock, SERCOM7/PAD[2], GCLK/IO[0].
58 PA31 bidirectional General-purpose I/O PA31 (EXTINT[15]); SWDIO serial wire debug data, SERCOM7/PAD[3].
59 PB30 bidirectional General-purpose I/O PB30 (EXTINT[14]); SWO output in non-single-wire debug modes, SERCOM7/PAD[0].
60 PB31 bidirectional General-purpose I/O PB31 (EXTINT[15]) with SERCOM7/PAD[1], TC0/WO[1], TCC4/WO[1].
61 PB00 bidirectional General-purpose I/O PB00 (EXTINT[0]) with ADC0/AIN[12], PTC X30/Y30, RTC tamper IN0.
62 PB01 bidirectional General-purpose I/O PB01 (EXTINT[1]) with ADC0/AIN[13], PTC X31/Y31, RTC tamper OUT / SUPC OUT0.
63 PB02 bidirectional General-purpose I/O PB02 (EXTINT[2]) with ADC0/AIN[14], PTC X20/Y20, RTC tamper IN1 / SUPC OUT1.
64 PB03 bidirectional General-purpose I/O PB03 (EXTINT[3]) with ADC0/AIN[15], PTC X21/Y21, SERCOM5/PAD[1].

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package TQFP-64(10x10)
Category Embedded Processors & Controllers
Pins 64

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Operating supply voltage VDD 1.71 3.63 V -40°C to +85°C, DC to 120 MHz 1
Operating temperature -40 85 °C Package grade U (Industrial) 19
VDDIOB supply voltage VDDIOB 1.71 3.63 V VDDIOB must be equal to or lower than VDDIO 46
VBAT supply voltage VBAT 1.71 3.63 V 46
VDDCORE voltage (internal regulator output) VDDCORE 1.2 V Typical; output for monitoring, not an input 46

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing pet nu1RBase nu1 I Crypto RAM u2RLength Base of R Base of R value filled repetitively with u4FillValue 1316
contacts tin including indium tin oxide (ITO) sensor grids. The PTC requires one pin per X-line and one pin per Y-line. In the Self Capacitance mode, the PTC requires only one pin (Y-line) for each touch sensor. 1697

CAD (KiCad official)

  • Symbol: ATSAMD51J18A-AU
  • Footprint: Package_QFP:TQFP-64_10x10mm_P0.5mm
  • 3D model: TQFP-64(10x10) (KiCad packages3D, STEP)
  • 3D model files: atsamd51j18a-au-etched.step / atsamd51j18a-au-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); atsamd51j18a-au.step / atsamd51j18a-au.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (1934 pp, sha256 6f02ccc3e69325ab, retrieved 2026-11-13, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF