ATSAMD51G19A-MU from Microchip Tech, in a QFN-48-EP(7x7). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	PA00	bidirectional	General-purpose I/O PA00 with EXTINT[0], SERCOM1 PAD[0] and TC2 WO[0]; also the XIN32 pin of XOSC32K.
2	PA01	bidirectional	General-purpose I/O PA01 with EXTINT[1], SERCOM1 PAD[1] and TC2 WO[1]; also the XOUT32 pin of XOSC32K.
3	PA02	bidirectional	General-purpose I/O PA02 with EXTINT[2], ADC0 AIN[0] and DAC VOUT[0]; also RTC tamper input IN2.
4	PA03	bidirectional	General-purpose I/O PA03 with EXTINT[3], ANAREF VREFA, ADC0 AIN[1] and PTC X0/Y0.
5	GNDANA	power_in	Analog ground.
6	VDDANA	power_in	Analog supply.
7	PB08	bidirectional	General-purpose I/O PB08 with EXTINT[8], ADC0 AIN[2], ADC1 AIN[0], PTC X1/Y1, SERCOM4 PAD[0] and TC4 WO[0].
8	PB09	bidirectional	General-purpose I/O PB09 with EXTINT[9], ADC0 AIN[3], ADC1 AIN[1], PTC X2/Y2, SERCOM4 PAD[1] and TC4 WO[1].
9	PA04	bidirectional	General-purpose I/O PA04 with EXTINT[4], ANAREF VREFB, ADC0 AIN[4], AC AIN[0] and SERCOM0 PAD[0].
10	PA05	bidirectional	General-purpose I/O PA05 with EXTINT[5], ADC0 AIN[5], AC AIN[1], DAC VOUT[1] and SERCOM0 PAD[1].
11	PA06	bidirectional	General-purpose I/O PA06 with EXTINT[6], ANAREF VREFC, ADC0 AIN[6], AC AIN[2] and SERCOM0 PAD[2].
12	PA07	bidirectional	General-purpose I/O PA07 with EXTINT[7], ADC0 AIN[7], AC AIN[3] and SERCOM0 PAD[3].
13	PA08	bidirectional	High-sink general-purpose I/O PA08 with NMI, ADC0 AIN[8], QSPI DATA[0], SERCOM0/2 and I2C support.
14	PA09	bidirectional	High-sink general-purpose I/O PA09 with EXTINT[9], ADC0 AIN[9], QSPI DATA[1], SERCOM0/2 and I2C support.
15	PA10	bidirectional	General-purpose I/O PA10 with EXTINT[10], ADC0 AIN[10], QSPI DATA[2] and SERCOM0/2.
16	PA11	bidirectional	General-purpose I/O PA11 with EXTINT[11], ADC0 AIN[11], QSPI DATA[3] and SERCOM0/2.
17	VDDIO	power_in	Digital I/O supply.
18	GND	power_in	Ground.
19	PB10	bidirectional	General-purpose I/O PB10 with EXTINT[10], QSPI SCK, SERCOM4 PAD[2] and TC5 WO[0].
20	PB11	bidirectional	General-purpose I/O PB11 with EXTINT[11], QSPI CS, SERCOM4 PAD[3] and TC5 WO[1].
21	PA12	bidirectional	High-sink general-purpose I/O PA12 with I2C support on VDDIO.
22	PA13	bidirectional	High-sink general-purpose I/O PA13 with I2C support on VDDIO.
23	PA14	bidirectional	General-purpose I/O PA14; also XIN of XOSC0.
24	PA15	bidirectional	General-purpose I/O PA15; also XOUT of XOSC0.
25	PA16	bidirectional	High-sink general-purpose I/O PA16 with I2C support on VDDIO.
26	PA17	bidirectional	High-sink general-purpose I/O PA17 with I2C support on VDDIO.
27	PA18	bidirectional	General-purpose I/O PA18 with PORT peripheral multiplexing.
28	PA19	bidirectional	General-purpose I/O PA19 with PORT peripheral multiplexing.
29	PA20	bidirectional	General-purpose I/O PA20 with EXTINT[4], PTC X14/Y14, SERCOM5 PAD[2] and TC7 WO[0].
30	PA21	bidirectional	General-purpose I/O PA21 with EXTINT[5], PTC X15/Y15, SERCOM5 PAD[3] and TC7 WO[1].
31	PA22	bidirectional	High-sink general-purpose I/O PA22 with EXTINT[6], PTC X16/Y16, SERCOM3 PAD[0] and I2C support.
32	PA23	bidirectional	High-sink general-purpose I/O PA23 with EXTINT[7], PTC X17/Y17, SERCOM3 PAD[1], USB SOF 1kHz and I2C support.
33	PA24	bidirectional	General-purpose I/O PA24 with EXTINT[8], SERCOM3 PAD[2] and USB DM.
34	PA25	bidirectional	General-purpose I/O PA25 with EXTINT[9], SERCOM3 PAD[3] and USB DP.
35	GND	power_in	Ground.
36	VDDIO	power_in	Digital I/O supply.
37	PB22	bidirectional	General-purpose I/O PB22 with EXTINT[6], SERCOM1 PAD[2] and USB SOF 1kHz; also XIN of XOSC1.
38	PB23	bidirectional	General-purpose I/O PB23 with EXTINT[7], SERCOM1 PAD[3] and GCLK IO[1]; also XOUT of XOSC1.
39	PA27	bidirectional	General-purpose I/O PA27 with EXTINT[11], PTC X18/Y18 and GCLK IO[1].
40	RESETN	input	External reset input, active low.
41	VDDCORE	power_in	Core supply (regulated).
42	GND	power_in	Ground.
43	VSW	power_out	Internal buck regulator switching output.
44	VDDIO	power_in	Digital I/O supply.
45	PA30	bidirectional	General-purpose I/O PA30 with EXTINT[14]; SWCLK serial wire debug clock (VDDIO).
46	PA31	bidirectional	General-purpose I/O PA31 with EXTINT[15]; SWDIO serial wire debug data (VDDIO).
47	PB02	bidirectional	General-purpose I/O PB02 with EXTINT[2], ADC0 AIN[14], PTC X20/Y20 and SERCOM5 PAD[0]; RTC tamper IN1, SUPC OUT1.
48	PB03	bidirectional	General-purpose I/O PB03 with EXTINT[3], ADC0 AIN[15], PTC X21/Y21 and SERCOM5 PAD[1].
49	EP	passive	Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter	Value
Manufacturer	Microchip Tech
Package	QFN-48-EP(7x7)
Category	Embedded Processors & Controllers
Pins	49

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Supply voltage VDDIO	VDDIO	1.71		3.63	V	Powers I/O lines, XOSCn and internal regulator for VDDCORE	46
Supply voltage VDDANA	VDDANA	1.71		3.63	V	Must be the same voltage as VDDIO (VDD)	46
Supply voltage VDDIOB	VDDIOB	1.71		3.63	V	Must be equal to or lower than VDDIO	46
Supply voltage VBAT	VBAT	1.71		3.63	V	Powers the Automatic Power Switch	46
Internal regulator output VDDCORE	VDDCORE		1.2		V	Internal voltage regulator output in linear mode	46
Operating temperature (package grade U)		-40		85	°C	Package grade U (MU suffix), 1.71V to 3.63V	1
Maximum operating frequency				120	MHz	1.71V to 3.63V, -40°C to +85°C	1

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part	Material	Colour / plating	Datasheet says	Page
housing	pet		nu1RBase nu1 I Crypto RAM u2RLength Base of R Base of R value filled repetitively with u4FillValue	1316
contacts		tin	including indium tin oxide (ITO) sensor grids. The PTC requires one pin per X-line and one pin per Y-line. In the Self Capacitance mode, the PTC requires only one pin (Y-line) for each touch sensor.	1697

CAD (KiCad official)

Symbol: ATSAMD51G19A-MU
Footprint: Package_DFN_QFN:QFN-48-1EP_7x7mm_P0.5mm_EP5.15x5.15mm
3D model: QFN-48-EP(7x7) (KiCad packages3D, STEP)
3D model files: atsamd51g19a-mu-etched.step / atsamd51g19a-mu-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); atsamd51g19a-mu.step / atsamd51g19a-mu.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Microchip Tech datasheet (1934 pp, sha256 6f02ccc3e69325ab, retrieved 2026-11-10, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

ATSAMD51G19A-MU

Verified ATSAMD51G19A-MU

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3D Model

Symbol & Footprint

Schematic Symbol

PCB Footprint

Datasheet

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